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ADC12DC105LFEB/NOPB

Texas Instruments

ADC12DC105LFEB/NOPB by Texas Instruments

Texas Instruments ADC12DC105LFEB/NOPB is a dual 12-bit ADC evaluation board with 105MSPS sampling rate. It features a parallel data interface and 2Vpp input range, consuming 800mW @ 105MSPS. Ideal for evaluating Analog to Digital Converters in development projects.

Median Price

$460.645

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 1 parts In-Stock

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$102.370

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DigiKey

USA . 2 parts In-Stock

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$818.920

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Digiode

USA . 3,929 parts In-Stock

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$784.453

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Vyrian

USA . 7,697 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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$696.080

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$678.678

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$675.198

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Corphita

USA . 2,557 parts In-Stock

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$743.166

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$743.166

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Corohmni

South Africa . 277 parts In-Stock

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$825.740

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ChromeModa Solutions

Germany . 4,218 parts In-Stock

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Northwest PG Solutions

USA . 1,331 parts In-Stock

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DigiPath Technology Company

USA . 813 parts In-Stock

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Native Components

USA . 455 parts In-Stock

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IDEA Electronic Components Group

UK . 163 parts In-Stock

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Parana Technologies

USA . 77 parts In-Stock

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$1.250

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Overview

Unlock the power of precision with the ADC12DC105LFEB/NOPB by Texas Instruments. This top-notch development board boasts unmatched quality and reliability from a trusted manufacturer. Ideal for a range of applications, this dual-channel analog to digital converter evaluation board offers unparalleled performance at a sampling rate of 105MSPS. Experience seamless data interface, a wide input range, and low power consumption, all packed in a convenient box package. Elevate your projects with the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Other Names: ADC12DC105LFEBNOPB

Unique model number for easy identification and compatibility

Category: Development Boards, Kits, Programmers

Versatile for use in various development projects

Number of A/D Converters: 2

Dual converters allow for parallel processing and increased efficiency

Number of Bits: 12

Higher resolution for more accurate digital conversions

Sampling Rate (Per Second): 105M

High sampling rate enables real-time data acquisition and processing

Data Interface: Parallel

Faster data transfer compared to serial interfaces

Input Range: 2Vpp

Wide input range for compatibility with different signal levels

Power (Typ) @ Conditions: 800mW @ 105MSPS

Efficient power consumption for high-speed sampling

Utilized IC / Part: ADC12DC105

Specific integrated circuit for optimized performance

Supplied Contents: Board(s)

Ready-to-use evaluation board for quick setup and testing

Base Product Number: ADC12D

Part of a recognized product line for compatibility and support

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for various environmental conditions without risk of damage

Technical Specifications

Additional Parts ADC12DC105LFEB/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

ADC12DC105LFEBNOPB

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

2

Data Interface:

Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

2Vpp

Number of Bits:

12

Utilized IC / Part:

ADC12DC105

Package:

Box

Sampling Rate (Per Second):

105M

Power (Typ) @ Conditions:

800mW @ 105MSPS

Base Product Number:

ADC12D

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

ADC12DC105LFEB/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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