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ADC12D2000RFIUT

Texas Instruments

ADC12D2000RFIUT by Texas Instruments

Texas Instruments' ADC12D2000RFIUT is a 12-bit ADC with 2 analog in channels, 4000 MHz sample rate, and 0.86V max analog input voltage. It is used in industrial applications for high-speed data conversion with serial/parallel output formats and proprietary conversion method.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,850 parts In-Stock

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2,850

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Digiode

USA . 1,093 parts In-Stock

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1,093

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Nova Conductors

Japan . 77 parts In-Stock

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77

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VNN

France . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 146 parts In-Stock

1+ parts

$5.611

100+ parts

-

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$6.409

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146

$5.611

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$6.409

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DigiPath Technology Company

USA . 1,407 parts In-Stock

1+ parts

$6.178

100+ parts

$5.684

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1,407

$6.178

$5.684

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ChromeModa Solutions

Germany . 5,273 parts In-Stock

1+ parts

$6.304

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$5.169

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$6.304

$5.169

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IDEA Electronic Components Group

UK . 2,218 parts In-Stock

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$6.304

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$5.674

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2,218

$6.304

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$5.674

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Ampacity Inc.

Singapore . 873 parts In-Stock

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$7.000

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873

$7.000

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AZTECH Wire

Italy . 397 parts In-Stock

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$11.363

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397

$11.363

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One Stop Electronics

USA . 807 parts In-Stock

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$35.000

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807

$35.000

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Corphita

USA . 4,244 parts In-Stock

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Continental Prestige Electronics

USA . 2,778 parts In-Stock

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2,778

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Argo Parts USA

USA . 2,042 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

USA . 196 parts In-Stock

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196

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Overview

Unlock a world of high-quality analog-to-digital conversion with the ADC12D2000RFIUT by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers unparalleled precision and reliability in its products. This versatile converter boasts a range of applications in industrial settings, offering customers exceptional value and performance. Experience seamless integration, superior functionality, and unmatched results with the ADC12D2000RFIUT. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options.

Surface Mount: YES

Surface mount capability simplifies PCB assembly and saves space.

No. of Bits: 12

12-bit resolution provides precise and accurate conversion of analog signals to digital.

No. of Terminals: 292

High number of terminals allows for complex connections and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can be used in various industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable performance in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal position helps in easy PCB design and layout.

Maximum Seated Height: 2.58 mm

Low seated height makes it suitable for compact designs.

Width: 27 mm

Standard width for easy integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time minimizes the risk of damage during soldering process.

Peak Reflow Temperature °C: 220

High peak reflow temperature ensures reliable solder joints.

Length: 27 mm

Compact length saves valuable PCB space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating allows for use in harsh environments.

Maximum Analog Input Voltage: 0.86 V

High maximum analog input voltage range for versatile signal processing.

Sample Rate: 4000 MHz

High sample rate enables fast and accurate data conversion.

Terminal Form: BALL

Ball terminal form provides secure connections in the PCB.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary ADC method ensures optimized performance and accuracy.

Nominal Supply Voltage: 2 V

Low nominal supply voltage for energy-efficient operation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Multiple output bit codes for flexible data representation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy soldering and connectivity.

Minimum Analog Input Voltage: -0.86 V

Wide range of analog input voltage accommodates various signal levels.

Output Format: SERIAL, PARALLEL, WORD

Multiple output formats for seamless integration with different systems.

Sample and Hold/Track and Hold: TRACK

Track and hold feature ensures accurate signal sampling.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the component is sensitive to moisture but can be handled with standard precautions.

Technical Specifications

Analog-to-Digital Converters ADC12D2000RFIUT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Sample Rate:

4000 MHz

Hold Mode:

Track

Electrical Specifications

Minimum Analog Input Voltage:

-860 mV

Maximum Analog Input Voltage:

860 mV

Nominal Supply Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

220 °C (428 °F)

Maximum Time At Peak Reflow Temperature:

20 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

292

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

1.063 in (27 mm)

Length:

1.063 in (27 mm)

Maximum Seated Height:

0.102 in (2.58 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Heat Sink/Slug

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B292

Trade Compliance

ADC12D2000RFIUT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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