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ADC09QJ800AAV

Texas Instruments

ADC09QJ800AAV by Texas Instruments

Texas Instruments ADC09QJ800AAV is a 9-bit ADC with 4 analog channels, 800 MHz sample rate, and 0.09765% linearity error. Ideal for applications requiring high-speed data conversion in compact spaces due to its small form factor and serial output format.

Median Price

$33.640

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,639 parts In-Stock

1+ parts

$33.640

100+ parts

$30.450

1k+ parts

$29.000

10k+ parts

-

1,639

$33.640

$30.450

$29.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,588 parts In-Stock

1+ parts

$31.958

100+ parts

-

1k+ parts

-

10k+ parts

-

1,588

$31.958

-

-

-

Vyrian

USA . 6,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,801

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 934 parts In-Stock

1+ parts

$0.265

100+ parts

-

1k+ parts

-

10k+ parts

$0.254

934

$0.265

-

-

$0.254

Northwest PG Solutions

USA . 2,266 parts In-Stock

1+ parts

$0.291

100+ parts

-

1k+ parts

-

10k+ parts

$0.257

2,266

$0.291

-

-

$0.257

Parana Technologies

USA . 2,005 parts In-Stock

1+ parts

$4.751

100+ parts

-

1k+ parts

$5.252

10k+ parts

-

2,005

$4.751

-

$5.252

-

DigiPath Technology Company

USA . 1,776 parts In-Stock

1+ parts

$5.231

100+ parts

$4.813

1k+ parts

-

10k+ parts

-

1,776

$5.231

$4.813

-

-

ChromeModa Solutions

Germany . 6,585 parts In-Stock

1+ parts

$5.338

100+ parts

$4.377

1k+ parts

-

10k+ parts

-

6,585

$5.338

$4.377

-

-

IDEA Electronic Components Group

UK . 1,020 parts In-Stock

1+ parts

$5.338

100+ parts

-

1k+ parts

$4.804

10k+ parts

-

1,020

$5.338

-

$4.804

-

AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$15.020

100+ parts

-

1k+ parts

-

10k+ parts

-

563

$15.020

-

-

-

Corphita

USA . 2,930 parts In-Stock

1+ parts

$30.276

100+ parts

-

1k+ parts

-

10k+ parts

-

2,930

$30.276

-

-

-

Microchip USA

USA . 1,338 parts In-Stock

1+ parts

$97.680

100+ parts

$95.980

1k+ parts

$95.130

10k+ parts

$94.280

1,338

$97.680

$95.980

$95.130

$94.280

Overview

Discover the cutting-edge ADC09QJ800AAV by Texas Instruments, a top-of-the-line Analog-to-Digital Converter designed to meet your highest quality standards. With a focus on precision and reliability, Texas Instruments has crafted a product that exceeds industry expectations. Perfect for a variety of applications, this converter offers unparalleled value, benefits, and advantages to customers looking for superior performance. Upgrade your technology with the ADC09QJ800AAV and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can protect the internal components of the Analog-to-Digital Converter from external damage.

No. of Analog In Channels: 4

Having 4 Analog In Channels allows for multiple inputs to be converted simultaneously, increasing efficiency in data conversion.

Surface Mount: YES

Surface mount capability makes it easier to integrate this Analog-to-Digital Converter into circuit boards, saving space and improving overall design.

No. of Bits: 9

With 9 bits, this converter can provide higher resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.09765 %

The low Maximum Linearity Error ensures accurate conversion of analog signals to digital, making this product reliable for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The Grid Array, Fine Pitch package style offers a compact design, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high Maximum Operating Temperature range allows this Analog-to-Digital Converter to function efficiently in various environments and conditions.

Nominal Supply Voltage: 1.1 V

The low Nominal Supply Voltage requirement makes this product energy-efficient.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this Analog-to-Digital Converter can withstand a moderate level of moisture exposure, ensuring its reliability in different environments.

Technical Specifications

Analog-to-Digital Converters ADC09QJ800AAV attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

9

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.09765 %

Sample Rate:

800 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-800 mV

Maximum Analog Input Voltage:

800 mV

Nominal Supply Voltage:

1.1 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Trade Compliance

ADC09QJ800AAV Converters trade compliance attributes, and parameters.

ECCN

3A991.C.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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