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ADC08DJ3200AAV

Texas Instruments

ADC08DJ3200AAV by Texas Instruments

Texas Instruments ADC08DJ3200AAV is an 8-bit ADC with 2 analog in channels, operating from -40 to 85°C. It offers a sample rate of 3200 MHz and supports output formats like serial and parallel. Ideal for industrial applications requiring high-speed data conversion.

Median Price

$957.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 321 parts In-Stock

1+ parts

$957.000

100+ parts

$866.250

1k+ parts

$825.000

10k+ parts

-

321

$957.000

$866.250

$825.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,312 parts In-Stock

1+ parts

$909.150

100+ parts

-

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-

10k+ parts

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4,312

$909.150

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Vyrian

USA . 3,745 parts In-Stock

1+ parts

-

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3,745

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VNN

France . 3,582 parts In-Stock

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-

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3,582

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

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100

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 23 parts In-Stock

1+ parts

$6.291

100+ parts

-

1k+ parts

$7.042

10k+ parts

-

23

$6.291

-

$7.042

-

DigiPath Technology Company

USA . 2,259 parts In-Stock

1+ parts

$6.927

100+ parts

$6.373

1k+ parts

-

10k+ parts

-

2,259

$6.927

$6.373

-

-

ChromeModa Solutions

Germany . 3,173 parts In-Stock

1+ parts

$7.068

100+ parts

$5.796

1k+ parts

-

10k+ parts

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3,173

$7.068

$5.796

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IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$7.068

100+ parts

-

1k+ parts

$6.361

10k+ parts

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1,389

$7.068

-

$6.361

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Corohmni

South Africa . 359 parts In-Stock

1+ parts

$9.975

100+ parts

-

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359

$9.975

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$13.196

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-

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638

$13.196

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$27.167

100+ parts

$24.722

1k+ parts

$22.277

10k+ parts

-

1,000

$27.167

$24.722

$22.277

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Microchip USA

USA . 1,838 parts In-Stock

1+ parts

$591.070

100+ parts

$561.520

1k+ parts

$546.740

10k+ parts

$531.970

1,838

$591.070

$561.520

$546.740

$531.970

Semicontronic

India . 162 parts In-Stock

1+ parts

$813.450

100+ parts

$793.114

1k+ parts

$789.046

10k+ parts

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162

$813.450

$793.114

$789.046

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Ampacity Inc.

Singapore . 112 parts In-Stock

1+ parts

$813.450

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112

$813.450

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Corphita

USA . 2,507 parts In-Stock

1+ parts

$861.300

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2,507

$861.300

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Argo Parts USA

USA . 4,173 parts In-Stock

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4,173

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iodParts Technologies Inc.

India . 2,321 parts In-Stock

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2,321

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Continental Prestige Electronics

USA . 1,178 parts In-Stock

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1,178

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Elevate your analog-to-digital conversion experience with the ADC08DJ3200AAV by Texas Instruments. Renowned for their top-notch quality and innovation, Texas Instruments delivers cutting-edge solutions that exceed expectations. Ideal for a wide range of applications, this ADC boasts high performance and reliability in a compact package, making it a versatile choice for your needs. Unlock the value of precision and efficiency with the ADC08DJ3200AAV, providing unparalleled benefits and advantages to elevate your projects to new heights. Trust in Texas Instruments to deliver excellence, every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, making it suitable for various applications.

No. of Analog In Channels: 2

Allows for input from multiple analog sources, increasing versatility and functionality.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Facilitates compact and organized PCB design, helping with layout and integration in electronic systems.

No. of Bits: 8

Provides high resolution for accurate analog-to-digital conversion, ensuring precise measurement and control.

No. of Terminals: 144

Offers plenty of connection points for interfacing with other components, enhancing connectivity and compatibility.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhances signal integrity and reduces noise interference, leading to reliable and stable performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where temperature fluctuations are common, ensuring the product can withstand harsh conditions.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold conditions, expanding the range of applications for the product.

Terminal Finish: TIN SILVER COPPER

Ensures good electrical conductivity and corrosion resistance, improving overall product lifespan and performance.

Terminal Position: BOTTOM

Facilitates easy routing and connectivity during PCB assembly, simplifying the manufacturing process.

Maximum Seated Height: 1.94 mm

Low profile design saves space and enables installations in compact electronic devices.

Width: 10 mm

Compact size allows for easy integration into various electronic systems and devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, maintaining the reliability and performance of the product.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering process, ensuring a secure connection to the PCB.

Length: 10 mm

Compact size facilitates flexible placement on PCBs, optimizing the use of available space.

Temperature Grade: INDUSTRIAL

Designed to meet the demands of industrial environments, ensuring reliable operation in harsh conditions.

Maximum Analog Input Voltage: 0.8 V

Wide input voltage range accommodates various signal levels, increasing compatibility with different analog sources.

Sample Rate: 3200 MHz

High sampling frequency provides fast and accurate data conversion, essential for real-time applications.

Terminal Form: BALL

Ball terminals offer secure connections and ease of soldering, enhancing the overall reliability of the product.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes a proprietary analog-to-digital conversion method, potentially offering improved performance and efficiency.

Nominal Supply Voltage: 1.1 V

Optimized supply voltage for efficient operation, balancing performance with power consumption.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in selecting the desired output format, accommodating different system requirements.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for high-density mounting on PCBs, optimizing space usage.

Minimum Analog Input Voltage: -0.8 V

Supports negative input voltage levels, allowing for a wide range of analog signal processing capabilities.

Output Format: SERIAL, PARALLEL, 8 BITS

Offers multiple output formats for compatibility with various systems and applications, enhancing flexibility.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, ensuring reliability in different operating environments.

Technical Specifications

Analog-to-Digital Converters ADC08DJ3200AAV attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, 8 Bits

Sample Rate:

3200 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-800 mV

Maximum Analog Input Voltage:

800 mV

Nominal Supply Voltage:

1.1 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Trade Compliance

ADC08DJ3200AAV Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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