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74AVCH2T45DCTTE4

Texas Instruments

74AVCH2T45DCTTE4 by Texas Instruments

74AVCH2T45DCTTE4 by Texas Instruments is a bus driver with 2 bits, operating at 1.5/3.3V, featuring a propagation delay of 5.4 ns. It is designed for bidirectional control applications in industrial settings, with a small outline package and low profile design for space-constrained environments. The device offers true output polarity and 3-state output characteristics, making it suitable for various digital signal transmission needs.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 237 parts In-Stock

1+ parts

$2.320

100+ parts

$1.100

1k+ parts

$0.724

10k+ parts

$0.694

237

$2.320

$1.100

$0.724

$0.694

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,670 parts In-Stock

1+ parts

$1.406

100+ parts

-

1k+ parts

-

10k+ parts

-

1,670

$1.406

-

-

-

Vyrian

USA . 4,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,256

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,039 parts In-Stock

1+ parts

$1.332

100+ parts

-

1k+ parts

-

10k+ parts

-

3,039

$1.332

-

-

-

Andel Nordic

Denmark . 492 parts In-Stock

1+ parts

$6.383

100+ parts

-

1k+ parts

$6.128

10k+ parts

$6.128

492

$6.383

-

$6.128

$6.128

Parana Technologies

USA . 191 parts In-Stock

1+ parts

$29.820

100+ parts

$2,769.271

1k+ parts

$26.838

10k+ parts

-

191

$29.820

$2,769.271

$26.838

-

DigiPath Technology Company

USA . 2,126 parts In-Stock

1+ parts

$32.836

100+ parts

-

1k+ parts

-

10k+ parts

-

2,126

$32.836

-

-

-

ChromeModa Solutions

Germany . 4,640 parts In-Stock

1+ parts

$33.506

100+ parts

$27.475

1k+ parts

-

10k+ parts

-

4,640

$33.506

$27.475

-

-

IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$33.506

100+ parts

$31.831

1k+ parts

$30.155

10k+ parts

-

637

$33.506

$31.831

$30.155

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Microchip USA

USA . 2,828 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,828

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Northwest PG Solutions

USA . 1,029 parts In-Stock

1+ parts

-

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1,029

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-

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Native Components

USA . 967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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967

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-

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Overview

Enhance your electronic designs with the high-quality 74AVCH2T45DCTTE4 by Texas Instruments. As a leading manufacturer, Texas Instruments delivers reliable Bus Driver & Transceivers that are perfect for a wide range of applications. This versatile product offers seamless translation between different voltage levels, ensuring efficient performance and compatibility. With its compact design and advanced technology, the 74AVCH2T45DCTTE4 provides exceptional value and functionality to customers looking to elevate their projects to the next level. Experience the benefits of Texas Instruments' innovative solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the bus driver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 5.4 ns

The low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed communication applications.

Surface Mount: YES

The ability to be surface mounted allows for easy and convenient integration into electronic circuits, saving space and simplifying assembly.

No. of Bits: 2

With 2 bits, this bus driver can handle multiple data inputs and outputs effectively, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this bus driver can perform reliably in various environments, including industrial settings.

Technical Specifications

Bus Driver & Transceivers 74AVCH2T45DCTTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

1.5/3.3V&1.5/3.3V

Width:

2.8 mm

Trade Compliance

74AVCH2T45DCTTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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