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74AVCA164245ZQLR

Texas Instruments

74AVCA164245ZQLR by Texas Instruments

74AVCA164245ZQLR by Texas Instruments is a bus driver & transceiver with 8 bits, operating at 1.5/3.3V supply voltage. It features a propagation delay of 6.8 ns, output characteristics in 3-STATE, and can handle up to 12 Amps. Ideal for industrial applications requiring bidirectional control with common control interface in a compact package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,038 parts In-Stock

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Chip Stock

USA . 6,350 parts In-Stock

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Digiode

USA . 2,484 parts In-Stock

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Sea View Technologies

USA . 613 parts In-Stock

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Bristol Electronics

USA . 613 parts In-Stock

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Cyclops Electronics Ltd

UK . 105 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 24 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 252 parts In-Stock

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$3.856

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-

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$3.701

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$3.701

252

$3.856

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$3.701

$3.701

AZTECH Wire

Italy . 602 parts In-Stock

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$14.206

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One Stop Electronics

USA . 171 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,934 parts In-Stock

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$22.843

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$23.504

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DigiPath Technology Company

USA . 1,471 parts In-Stock

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$25.153

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ChromeModa Solutions

Germany . 2,827 parts In-Stock

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$25.666

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$21.046

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

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$25.666

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$24.383

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$23.099

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Perfect Parts

USA . 12,824 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,183 parts In-Stock

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Corphita

USA . 1,947 parts In-Stock

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Northwest PG Solutions

USA . 1,787 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 738 parts In-Stock

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Computer Components Inc. - USA

USA . 343 parts In-Stock

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Microchip USA

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Native Components

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Overview

Experience superior performance and reliability with the Texas Instruments 74AVCA164245ZQLR Bus Driver & Transceivers. This cutting-edge product boasts top-notch quality and unmatched precision, making it a standout choice for a wide range of applications. From industrial automation to telecommunications, this versatile component delivers exceptional value and benefits to customers looking for seamless integration and efficient operation. Trust in Texas Instruments to provide you with the best in class solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed bus communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single component can reduce the overall component count in a system, leading to cost savings and improved efficiency.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to place and secure the bus driver & transceiver on a PCB, ensuring proper alignment and connection to other components.

No. of Bits: 8

8-bit functionality allows for a wide range of data processing capabilities, making this product versatile for various communication protocols and applications.

Translation: 1.5/3.3V&1.5/3.3V

Support for voltage translation between 1.5V and 3.3V enables compatibility with different voltage levels in a system, ensuring seamless communication between components.

Technical Specifications

Bus Driver & Transceivers 74AVCA164245ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

4.5 mm

Trade Compliance

74AVCA164245ZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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