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5962-8992801XC

Texas Instruments

5962-8992801XC by Texas Instruments

5962-8992801XC by Texas Instruments is a display controller with 1280x1024 pixel config, operating at max clock freq of 110MHz. Ideal for military-grade applications, it features a ceramic-metal-sealed package body, 84 terminals, and operates b/w -55°C to 125°C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,038 parts In-Stock

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Digiode

USA . 2,376 parts In-Stock

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One Stop Electronics

USA . 1,288 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 285 parts In-Stock

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$19.735

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Parana Technologies

USA . 1,631 parts In-Stock

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$49.582

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ChromeModa Solutions

Germany . 6,295 parts In-Stock

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$55.710

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$45.682

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IDEA Electronic Components Group

UK . 851 parts In-Stock

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$55.710

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$52.924

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$50.139

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851

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Corohmni

South Africa . 1,993 parts In-Stock

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$65.396

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Corphita

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DigiPath Technology Company

USA . 931 parts In-Stock

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$50.228

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Native Components

USA . 865 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock the power of cutting-edge technology with the 5962-8992801XC by Texas Instruments. As a leader in display controllers, Texas Instruments delivers unparalleled quality and reliability to meet your needs. Whether you're designing for military applications or industrial settings, this display controller offers seamless integration and precision performance. Elevate your projects with the ultimate combination of innovation and value that only Texas Instruments can provide. Experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides durability and reliability for the display controller.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power input options for the display controller.

Address Bus Width: 2

The 2-bit address bus width allows for efficient communication and address handling within the display controller.

Package Shape: SQUARE

The square package shape optimizes space utilization and ensures a compact design for the display controller.

No. of Terminals: 84

With 84 terminals, the display controller can accommodate a variety of connections and peripherals for enhanced functionality.

Package Style (Meter): GRID ARRAY

The grid array package style allows for easy installation and secure mounting of the display controller.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures energy efficiency and prevents overloading of the display controller.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the display controller can function reliably even in challenging environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the display controller to operate in a wide range of temperature conditions.

Terminal Position: PERPENDICULAR

The perpendicular terminal position enables easy and secure connection of the display controller to other components.

Display Config: 1280 X 1024 PIXELS

The high display configuration of 1280 x 1024 pixels ensures clear and crisp visuals on the connected display.

Maximum Seated Height: 5.21 mm

The low maximum seated height allows for a compact and space-saving design for the display controller.

Width: 32 mm

The 32mm width provides a balance between compactness and functionality for the display controller.

External Data Bus Width: 8

The 8-bit external data bus width allows for fast and efficient data transfer within the display controller.

Maximum Clock Frequency: 110 MHz

The high maximum clock frequency of 110 MHz ensures smooth and seamless operation of the display controller.

Length: 32 mm

The 32mm length complements the width and ensures a well-proportioned design for the display controller.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the display controller can withstand harsh environmental conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC as peripheral IC types enhances the functionality and versatility of the product.

Technology: CMOS

The CMOS technology ensures low power consumption and high performance for the display controller.

Terminal Form: PIN/PEG

The PIN/PEG terminal form allows for secure and stable connections with other components in the system.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides a stable and consistent power source for the display controller.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch enables easy connection and compatibility with standard connectors and interfaces.

Technical Specifications

Display Controllers 5962-8992801XC attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

2

Maximum Clock Frequency:

110 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P84

Length:

32 mm

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Peripheral IC Type:

Trade Compliance

5962-8992801XC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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