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5962-01-033-5023

Texas Instruments

5962-01-033-5023 by Texas Instruments

Texas Instruments' 5962-01-033-5023 is a MOS Digital Shift Register with 32 bits and 6 functions. It has a rectangular package style, 24 terminals, and operates b/w -25°C to 85°C. Ideal for applications requiring precise data shifting in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,662 parts In-Stock

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Digiode

USA . 706 parts In-Stock

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706

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Northwest PG Solutions

USA . 73 parts In-Stock

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$3.283

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73

$3.283

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One Stop Electronics

USA . 745 parts In-Stock

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$8.000

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745

$8.000

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AZTECH Wire

Italy . 743 parts In-Stock

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$18.259

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743

$18.259

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Parana Technologies

USA . 1,321 parts In-Stock

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$18.916

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$18.985

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$18.916

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$18.985

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DigiPath Technology Company

USA . 66 parts In-Stock

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$20.829

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66

$20.829

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ChromeModa Solutions

Germany . 1,244 parts In-Stock

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$21.254

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$17.428

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$21.254

$17.428

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IDEA Electronic Components Group

UK . 846 parts In-Stock

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$21.254

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$20.191

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$19.129

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846

$21.254

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Corphita

USA . 1,961 parts In-Stock

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Native Components

USA . 899 parts In-Stock

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$2.895

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Overview

Unlock the power of digital shift registers with Texas Instruments' 5962-01-033-5023. Designed with precision and reliability in mind, this product offers seamless functionality with 32 bits across 6 functions. Perfect for a wide range of applications, this rectangular package is built to withstand extreme temperatures while delivering top-notch performance. Trust Texas Instruments to provide you with exceptional quality and value, making your projects a breeze.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and reliability of the shift register, making it suitable for long-term use.

No. of Functions: 6

Having 6 functions allows for more versatility and options in terms of how the shift register can be used.

Package Shape: RECTANGULAR

Rectangular shape makes the shift register easy to mount and integrate into existing systems or circuits.

No. of Bits: 32

With 32 bits, this shift register can handle a larger amount of data transfer and processing, making it suitable for complex applications.

No. of Terminals: 24

Having 24 terminals allows for more connections and options for interfacing with other components or devices.

Package Style (Meter): IN-LINE

In-line package style provides a compact and space-saving design, making it suitable for applications with limited space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the shift register can perform reliably even in demanding environments or conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows the shift register to function effectively in a wide range of temperatures.

Terminal Position: DUAL

Dual terminal position provides flexibility in how the shift register can be connected or mounted in a circuit.

Technology: MOS

MOS technology offers high speed and efficiency, making the shift register ideal for applications requiring fast data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and stable connections, minimizing the risk of loose connections or signal interference.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the shift register can be easily integrated and connected with other components or devices.

Technical Specifications

Digital Shift Registers 5962-01-033-5023 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Bits:

32

No. of Functions:

6

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-033-5023 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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