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201-000795

Texas Instruments

201-000795 by Texas Instruments

Texas Instruments' 201-000795 ADC features 32 analog in channels, 20 bits, and 0.05015% max linearity error. Ideal for commercial applications, this delta-sigma converter has a sample rate of 0.003125 MHz and operates at temperatures ranging from 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,042 parts In-Stock

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4,042

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Digiode

USA . 2,680 parts In-Stock

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2,680

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Distributors (Availability)

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Native Components

USA . 72 parts In-Stock

1+ parts

$2.138

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72

$2.138

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Northwest PG Solutions

USA . 1,350 parts In-Stock

1+ parts

$2.351

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1,350

$2.351

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One Stop Electronics

USA . 1,579 parts In-Stock

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$5.000

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1,579

$5.000

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Parana Technologies

USA . 2,180 parts In-Stock

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$11.458

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$11.875

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2,180

$11.458

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$11.875

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AZTECH Wire

Italy . 534 parts In-Stock

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$11.485

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534

$11.485

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$12.874

100+ parts

$12.230

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$11.587

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2,030

$12.874

$12.230

$11.587

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ChromeModa Solutions

Germany . 1,901 parts In-Stock

1+ parts

$12.874

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$10.557

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1,901

$12.874

$10.557

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$30.216

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$27.497

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$24.777

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200

$30.216

$27.497

$24.777

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Corohmni

South Africa . 269 parts In-Stock

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$108.402

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$108.402

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Microchip USA

USA . 2,521 parts In-Stock

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$136.350

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$133.980

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$132.790

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$131.610

2,521

$136.350

$133.980

$132.790

$131.610

Corphita

USA . 2,966 parts In-Stock

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DigiPath Technology Company

USA . 322 parts In-Stock

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$11.607

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Overview

Unlock the power of precision with the Texas Instruments 201-000795 Analog-to-Digital Converter. Crafted with excellence by a trusted manufacturer, this device offers 32 analog input channels in a sleek square package. Ideal for a wide range of applications, this converter boasts 20 bits of accuracy and a low linearity error for reliable performance. With a quick conversion time and compact design, the 201-000795 delivers unparalleled value, making it the perfect choice for your next project. Elevate your work with this top-tier solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection for the internal components of the ADC, ensuring durability and reliability.

No. of Analog In Channels: 32

Having 32 analog input channels allows for versatile and complex signal processing capabilities.

Surface Mount: YES

Surface mount capability makes it easy to integrate this ADC into a circuit board, saving space and simplifying assembly.

No. of Bits: 20

With a high resolution of 20 bits, this ADC can provide accurate and detailed conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.05015 %

The low maximum linearity error ensures that the digital output closely matches the input signal, leading to precise data conversion.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and easy integration into a circuit layout.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor and ease of soldering, making it suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this ADC can perform reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and component placement.

Maximum Conversion Time: 135.6 us

The fast conversion time allows for quick processing of analog signals into digital data, suitable for real-time applications.

Maximum Seated Height: 1.45 mm

The low seated height makes this ADC suitable for compact electronic devices with limited vertical space.

Width: 8 mm

The compact width of 8 mm enables easy integration into circuit layouts with space constraints.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder connections during assembly and maintenance processes.

Length: 8 mm

The short length of 8 mm contributes to the overall compact design of this ADC.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where moderate temperature ranges are expected.

Sample Rate: 0.003125 MHz

The high sample rate allows for capturing high-frequency signals accurately, making this ADC suitable for diverse signal processing tasks.

Terminal Form: BALL

The ball terminal form facilitates reliable connections and easy soldering during the assembly process.

Converter Type: ADC, DELTA-SIGMA

Delta-sigma converter type offers high precision and accuracy in analog-to-digital conversion, making this ADC suitable for demanding applications.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in electronic systems, ensuring compatibility with a wide range of applications.

Output Bit Code: BINARY, OFFSET BINARY

The binary and offset binary output bit codes provide flexibility in digital data representation, allowing for easy interface with digital systems.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting on circuit boards, optimizing space usage.

Output Format: SERIAL

Serial output format simplifies data transmission and processing, making it suitable for communication interfaces in electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this ADC has moderate sensitivity to moisture, requiring standard handling and storage precautions.

Technical Specifications

Analog-to-Digital Converters 201-000795 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

32

No. of Functions:

1

No. of Bits:

20

Output Bit Code:

Binary, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.05015 %

Sample Rate:

3.125 kHz

Maximum Conversion Time:

135.6 µs

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Trade Compliance

201-000795 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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