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CY7C291A-35KMB

Teledyne E2v (Uk)

CY7C291A-35KMB by Teledyne E2v (Uk)

OTP ROM; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Input/Output Type: COMMON; Technology: CMOS;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Prism Electronics

USA . 20 parts In-Stock

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Resion

USA . 16 parts In-Stock

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Technical Specifications

OTP ROM CY7C291A-35KMB attributes and parameters. Explore more OTP ROM devices from Teledyne E2v (Uk)

Specs

Maximum Access Time:

35 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDFP-F24

Length:

15.367 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL24,.4

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Programming Voltage (V):

12.5

Maximum Seated Height:

2.54 mm

Maximum Supply Current:

90 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

9.652 mm

Trade Compliance

CY7C291A-35KMB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Teledyne E2v (Uk)

Teledyne e2v Innovators in semiconductors, high power RF, imaging, precision timing and engineered systems Our innovations enable our customers innovations through access to state-of-the-art technologies, driving the next generation of systems, in signal chain semiconductor devices, full spectrum imaging and high power radio frequency solutions. Teledyne e2v has an enviable history of employing some of the best minds who work with industry and academia in commercialising technologies of the future, developing high quality products, services and turn-key solutions produced through our world class global facilities that have real benefit to the world. Our teams passions have led to ground breaking improvements in cancer radiotherapy systems, ultra-high reliability in critical electronic systems and observing the effects of climate change from space

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