Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's SO63-2-00 heat shrink features single wall construction with crosslinked modified PVDF jacket material. Ideal for solder terminals, it has a max operating temp of 150°C and fits wire sizes up to 0 AWG.
Median Price
$1.870
Lifecycle Status
Suppliers In-Stock
18
In-Stock Inventory
1k+
Arrow
1+ parts
$0.962
100+ parts
-
1k+ parts
10k+ parts
WireMasters
$1.822
$1.695
$1.488
$1.402
Farnell
$2.470
$1.560
$1.320
Newark
$4.230
$3.250
$2.360
$2.200
Element14
$4.460
$3.230
$2.740
PEI Genesis
Verical
Chip1Stop
$1.660
$1.100
Master Electronics
$2.420
$1.810
$1.610
Powell Electronics
$1.590
$1.330
$1.310
TTI Europe
$1.554
$1.179
$0.858
Electro Enterprises
$1.319
$1.123
$0.910
Nova Conductors
$1.486
Electro Sonic
$1.680
$1.470
$1.270
Rapid Electronics
$2.909
IBS Electronics
$3.394
$2.539
$2.258
FDH Electronics
Mil-Aero Solutions, Inc.
Aranea Global
$1.456
$1.398
Assy Fe
Eastek
Perfect Parts
Cyclops Electronics Ltd (Excess)
GreenTree Electronics
Single wall construction ensures a tight fit around the wire or terminal, providing strong protection against moisture and other environmental factors.
This material is known for its excellent chemical resistance and durability, making the heat shrink suitable for a wide range of applications and ensuring long-lasting protection.
Solder terminals provide a reliable and permanent connection, ensuring secure and consistent performance in various electrical or electronic applications.
With a high maximum operating temperature, this heat shrink can withstand elevated temperatures without degrading, ensuring reliable performance even in demanding conditions.
The specific diameter ensures a snug fit around wires or terminals of compatible sizes, providing effective insulation and protection against mechanical damage or environmental factors.
Suitable for wires of up to 0 AWG size, this heat shrink can be used for a wide range of wire gauges, offering versatility and flexibility in various electrical or electronic projects.
Heat Shrinks SO63-2-00 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Diameter:
Jacket Material:
Maximum Operating Temperature:
Terminal Type:
Wire Gauge (AWG):
Maximum Wire Size:
SO63-2-00 Connector Accessories trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
PCN Design/Specification - Mult Devs product improvement 27/MAR/2020
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138PS,115
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
Bytesonic Electronics
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
Nexperia
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
462A011-25-0
TE Connectivity
TE Connectivity's 462A011-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for electrical insulation in various applications.
ATUM-32/8-0-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
382A023-25-06-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
VERSAFIT-3/64-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
RW-200-3/16-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED FLUOROELASTOMER; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 200 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
M83519/2-8
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
ATUM-19/6-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: DUAL WALL; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
202K132-12-01-0
TE Connectivity's 202K132-12-01-0 heat shrink features FLUOROELASTOMER material, with a max operating temp of 200°C and min cable entry of 5.9". Ideal for applications requiring high temp resistance and secure cable insulation up to 15" in size.
RNF-100-3/32-BK-SP-SM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
RW-175-3-64-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel;
820059-000
HEAT SHRINK 2-WAY JUNCTION; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG;
Commscope
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: MEDIUM WALL;
M23053/1-205-0
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED CHLORINATED POLYOLEFIN;
S200-2-01-100HN
TE Connectivity's S200-2-01-100HN heat shrink features single wall construction with crosslinked modified fluoropolymer jacket. It has a max operating temperature of 200°C, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminal connections in various applications requiring reliable insulation and protection.
M23053/5-105-9
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN; DIN Conformity: NO;
813355-000
TE Connectivity's 813355-000 heat shrink features single wall construction with polyolefin jacket material. It has a min cable entry of 0.22" and max operating temperature of 135°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size.
ZHTM-12/6-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel; Jacket Material: POLYOLEFIN;
M23053/5-106-0
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
D-110-41
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
ES1000-NO.4-B7-X-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -40 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 130 Cel; Construction: DUAL WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SO63-1-55-22-9
TE Connectivity SO63-1-55-22-9 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 1.9mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-2-9030
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Diameter: 2.65 mm;
SO63-2-9036-18
TE Connectivity SO63-2-9036-18 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-1-01-100
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-9030
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 5.95 mm; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-4-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
SO63-5-00
TE Connectivity's SO63-5-00 heat shrink features single wall construction with crosslinked modified PVDF jacket. With a max operating temp of 150°C, it accommodates 0 AWG wire and has a 7mm diameter. Ideal for solder terminals in various applications.
SO63-3-55-24-90
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
SO63-3-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0;
SO63-2-55-22-5
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Diameter: 2.65 mm; Terminal Type: SOLDER; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-9036-18
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-9036-20
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-4-9036-22
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 5.95 mm;
SO63-4-9036-22CS2677
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 22 AWG; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 22; Construction: SINGLE WALL;
SO63-2-55-22-2
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 2.65 mm; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-2-55-24-5
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-2-9036-22
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 22; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 22 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
SO63-4-00CS2567
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Diameter: 5.95 mm; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-55-20-90
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
SO63-2-W1-24-9-100
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: POLYVINYLIDENE FLUORIDE; Diameter: 2.65 mm; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved