Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity SO63-4-55-20-90 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. Solder terminal type, 150°C max operating temp, 5.95mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
Median Price
$3.769
Lifecycle Status
Suppliers In-Stock
18
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$3.060
100+ parts
$2.050
1k+ parts
-
10k+ parts
Farnell
$3.099
$2.795
Arrow
$3.925
Powell Electronics
$2.970
$1.800
Verical
$3.824
$2.271
PEI Genesis
TTI
$2.110
$1.830
$1.790
TTI Europe
$3.055
DigiKey
$17.713
$17.012
$16.672
Chip1Stop
$5.020
Electro Enterprises
$2.700
$2.298
$1.862
Nova Conductors
$2.938
IBS Electronics
$4.558
$2.707
$2.468
Electro Sonic
$2.370
$2.180
$1.810
Vyrian
FDH Electronics
Semi Source
Rapid Electronics
$4.710
Aranea Global
$2.879
$2.764
Assy Fe
Single wall construction makes this heat shrink lightweight and flexible, allowing for easy installation and maneuverability.
Polyvinylidene fluoride offers excellent chemical resistance and high temperature capabilities, making it suitable for a wide range of applications where durability and reliability are key.
Solder terminals ensure a secure and reliable connection, which is essential for maintaining the integrity of the electrical system.
The high maximum operating temperature of 150°C allows this heat shrink to be used in demanding environments without compromising performance.
The optimal diameter of 5.95mm ensures a snug fit around wires and cables, providing effective insulation and protection.
With a maximum wire size of 0 AWG, this heat shrink can accommodate thicker wires and cables, making it versatile for a variety of applications.
Heat Shrinks SO63-4-55-20-90 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Diameter:
Jacket Material:
Maximum Operating Temperature:
Terminal Type:
Maximum Wire Size:
SO63-4-55-20-90 Connector Accessories trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
Diodes Incorporated
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tesla Elektronicke Soucastky
General Semiconductor
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
STM32H753ZIT6
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
EU2B-YS303C
Idec
ROTARY SWITCH;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Panjit International
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FP-301-3/32-BLK-100
3m Electronic Products Division
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
M23053/8-004-C
TE Connectivity
HEAT SHRINK TUBE; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
NB11354001
HEAT SHRINK TUBE ; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
EH3268-000
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -75 Cel;
809S060-2H
Glenair
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN;
222D232-25-02/86-0
TE Connectivity's 222D232-25-02/86-0 heat shrink features ELASTOMER jacket material, 0.74" min cable entry, and 150°C max operating temp. Ideal for applications requiring -75°C min operating temp, accommodating up to 0 AWG wire size and 1.33" max cable entry.
322A112-25-0
TE Connectivity's 322A112-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for electrical insulation in various applications.
M23053/5-102-0
Defense Logistics Agency
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
ATUM-16/4-0-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 110 Cel;
TMS-SCE-1K-3/8-2.0-9
TE Connectivity's TMS-SCE-1K-3/8-2.0-9 is a single wall heat shrink with a polyolefin jacket material. It has a max operating temperature of 135°C and can be used as a heat shrink marker sleeve for wires up to 0 AWG.
TAT-125-3/8-0-2IN
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
RT-375-1/8-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
D-142-50
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
M23053/5-103-0
Brady
HEAT SHRINK TUBE; IEC Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; MIL Conformity: NO;
DR-25-1-1/2-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG;
M83519/2-8
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
RNF-100-3/4-RD-FSP
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
M23053/5-111-9
Grayline
HEAT SHRINK TUBE; IEC Conformity: NO; DIN Conformity: NO; MIL Conformity: NO; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
RNF-100-1/4-BN-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Maximum Wire Size: 0 AWG;
202K121-25-01/86-0
TE Connectivity's 202K121-25-01/86-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 14" with a min entry of 5.6". Ideal for electrical insulation in various applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SO63-1-55-22-9
TE Connectivity SO63-1-55-22-9 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 1.9mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-2-9030
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Diameter: 2.65 mm;
SO63-2-9036-18
TE Connectivity SO63-2-9036-18 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
SO63-1-01-100
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-9030
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 5.95 mm; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-4-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
SO63-5-00
TE Connectivity's SO63-5-00 heat shrink features single wall construction with crosslinked modified PVDF jacket. With a max operating temp of 150°C, it accommodates 0 AWG wire and has a 7mm diameter. Ideal for solder terminals in various applications.
SO63-3-55-24-90
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
SO63-3-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0;
SO63-2-55-22-5
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Diameter: 2.65 mm; Terminal Type: SOLDER; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-9036-18
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-4-9036-20
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-4-9036-22
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 5.95 mm;
SO63-4-9036-22CS2677
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 22 AWG; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 22; Construction: SINGLE WALL;
SO63-2-55-22-2
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 2.65 mm; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-2-55-24-5
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Terminal Type: SOLDER;
SO63-2-9036-22
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 22; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 22 AWG; Jacket Material: POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
SO63-4-00CS2567
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Diameter: 5.95 mm; Maximum Operating Temperature: 150 Cel; Jacket Material: POLYVINYLIDENE FLUORIDE;
SO63-2-00
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 2.65 mm; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
SO63-4-55-20-9
HEAT SHRINK SOLDER SLEEVE; Diameter: 5.95 mm; Construction: SINGLE WALL; Jacket Material: POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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