Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL;
Median Price
$6.700
Lifecycle Status
Suppliers In-Stock
17
In-Stock Inventory
1k+
Arrow
1+ parts
$5.745
100+ parts
$4.688
1k+ parts
-
10k+ parts
DigiKey
$6.100
Interstate Connecting
$6.319
$5.297
$5.003
RS Americas
$6.500
Powell Electronics
$5.400
Heilind Electronics
$6.796
$5.541
$5.376
Element14
$8.540
$5.500
Farnell
$9.279
$7.268
$5.944
PEI Genesis
Chip1Stop
$9.750
Verical
Nova Conductors
$7.130
IBS Electronics
$6.994
$6.890
$6.812
Vyrian
Quittner & Schimek s.r.o.
Rapid Electronics
ACDS - Activité Composants Distribution Service
Bastille Electronics
$6.774
$6.346
Continental Prestige Electronics
$8.830
$6.840
Authorized Procurement Solutions
Argo Parts USA
Perfect Parts
Heat Shrinks SCL-3/8-0-STK attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
PCN Assembly/Origin - Mult Devs Leadtime update 08/APR/2020
PCN Packaging - Mult Devs packaging 06/APR/2020 Mult Devs packaging chg 03/APR/2020
PCN Other - On hold due to requalification requirements 18/SEP/2023
PCN Part Status Change - On Hold due to Requalification 16/AUG/2023
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Philips Semiconductors
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
204W511-25-0
TE Connectivity
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER;
RNF-100-3/16-BK-SP-CS5004
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE;
RT555-1-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -65 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 200 Cel; Wire Gauge (AWG): 0;
TMS-SCE-1K-3/32-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
ATUM-12/3-0-SP-CS6877
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: POLYOLEFIN;
XFFR-04X4
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
878502-006
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
222K174-25/225-0
TE Connectivity's 222K174-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 0.618" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 1.378".
222K132-25/225-0
TE Connectivity's 222K132-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 5.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size, with a max cable entry of 15".
202K153-25-01/225-0
TE Connectivity's 202K153-25-01/225-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 20" in diameter. Ideal for applications requiring protection and insulation of large cables with a min entry of 8.4".
FIT-221-1/16RD017
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
202K111-25-0
TE Connectivity's 202K111-25-0 heat shrink features single wall construction with elastomer jacket material. It can withstand temperatures from -75°C to 150°C and accommodate wires up to 0 AWG. Ideal for electrical insulation in various applications.
TMS-SCE-1K-3/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
M83519/2-17
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
562A011-25-0
TE Connectivity's 562A011-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature environments.
RNF-100-1/16-0-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
ATUM-40/13-0-STK
Commscope
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN;
9556824001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 75 Cel; Construction: DUAL WALL;
382A012-100-0
HEAT SHRINK; Construction: SINGLE WALL; Additional Features: REFERENCE STANDARD: DEF; VG; Minimum Operating Temperature: -30 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
202K163-25-G03/225-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SCL-3/4-0-6IN
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
SCL-3/4-A1-0-40MM
SCL-3/4-A1-0-50MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
SCL-3/8-2-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel;
SCL-3/8-0-300MM
SCL-3/8-A1-0-75MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
SCL-3/16-0-6IN
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
SCL-3/16-0-45MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
SCL-3/4-2-STK
SCL-3/16-2-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL;
SCL-3/8-2-6IN
SCL-3/16-2-6IN
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL;
SCL-3/8-0-6IN
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel;
SCL-3/16-0-50MM
SCL-3/16-0-12IN
SCL-3/4-2-50MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel;
SCL-3/4-2-6IN
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel;
SCL-3/4-2-60MM
SCL-3/4-0-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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