Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 202C632-51-0 heat shrink features FLUORO-ELASTOMER jacket material, with a 0.5" min cable entry and 135°C max operating temp. Ideal for applications requiring -55 to 135°C range, accommodating up to 0 AWG wire size and 1.142" cable entry.
Median Price
$29.870
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Suppliers In-Stock
21
In-Stock Inventory
1k+
Avnet
1+ parts
$17.536
100+ parts
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1k+ parts
10k+ parts
Interstate Connecting
$21.719
$17.194
Arrow
$22.220
TTI
$22.390
$17.690
$17.190
Master Electronics
$32.290
$17.220
$16.770
Mouser Electronics
$35.970
$30.400
Newark
$42.190
TE Connectivity
$42.390
Verical
$28.098
Powell Electronics
$29.200
DigiKey
$218.191
AE Petsche
Chip1Stop
Nova Conductors
$24.510
Electro Sonic
$32.120
$25.330
$21.130
Electro Enterprises
$33.925
$28.872
$23.397
FDH Electronics
$40.370
$34.357
$27.841
IBS Electronics
$48.730
$24.534
$24.026
VNN
Vyrian
EMSNET
Advanced Electronics
$3.090
$2.936
Semicontronic
$17.000
$16.575
$16.490
Continental Prestige Electronics
$24.450
$23.961
Netroflash
Modulus Dynamics
$26.684
$26.418
$25.617
Argo Parts USA
Robosynatics
$0.126
Lucentia Tech
FLUORO-ELASTOMER material provides excellent resistance to heat, chemicals, and weathering, making this product suitable for demanding environments.
Allows for easy installation of cables with a minimum entry size of 0.5 inch, providing flexibility and convenience.
With a high maximum operating temperature of 135°C, this product can withstand elevated temperatures without degradation.
Capable of functioning in extremely low temperatures down to -55°C, ensuring reliability in cold environments.
Accommodates wires up to 0 AWG in size, allowing for compatibility with a wide range of wire thicknesses.
Provides ample space for cable entry up to 1.142 inches, enabling easy installation of larger cables.
FLUOROELASTOMER material offers superior durability and resilience, making this product a long-lasting and reliable choice.
Heat Shrinks 202C632-51-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Maximum Cable Entry:
Minimum Cable Entry:
Connector Accessory Type:
Jacket Material:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Wire Size:
PCN Design/Specification - Material location chg 07/FEB/2022
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
BAV99WT1G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
2N7002DWH6327XTSA1
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
1N4148
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
EU2B-YS3203F
Idec
ROTARY SWITCH;
M23053/5-103-9
Grayline
HEAT SHRINK TUBE; MIL Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; IEC Conformity: NO;
342A012-25-0
HEAT SHRINK 3-WAY JUNCTION; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
2M809A060-3G
HEAT SHRINK BOOT; Jacket Material: POLYMER;
FP-301-3/4-BLACK-50
3m Electronic Products Division
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: ABS; AMS-3636; AMS-3637; CSA; UL; Construction: SINGLE WALL;
HT-SCE-1/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 225 Cel; Wire Gauge (AWG): 0;
301A011-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
15179
Pro-power
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
RNF-100-1-1/2-9-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
S01-03-RCS899
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG;
TMS-SCE-3/16-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
856164-002
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
S02-17-R-3
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Diameter: 2.65 mm;
RNF-100-3/32-X-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
S02-08-R-95
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
RNF-100-1-4-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE;
CWT-3
HEAT SHRINK SOLDER SLEEVE; Diameter: 2.7 mm; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0;
TMS-SCE-3/16-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
ATUM-12/4-0-STK
Commscope
HEAT SHRINK TUBE; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
DR-25-1/2-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -75 Cel; Construction: SINGLE WALL;
DR-25-3/8-0-150FT/CSP
HEAT SHRINK TUBE; Jacket Material: ELASTOMER; Construction: SINGLE WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
770-022C603
Glenair
HEAT SHRINK BOOT; Jacket Material: CROSSLINKED ELASTOMER;
202C621-71-0
TE Connectivity's 202C621-71-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min operating temp of -55°C. Ideal for applications requiring a min cable entry of 8.1" and max wire size of 0 AWG.
202C611-71-0
HEAT SHRINK BOOT; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN;
202C632-71/42-0
TE Connectivity's 202C632-71/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, suitable for cables up to 0 AWG. With a temperature range of -55 to 135 °C, it accommodates cable entries from 0.5 to 1.142 inch. Ideal for applications requiring durable and flexible insulation solutions.
202C632-71/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Minimum Cable Entry: .5 inch; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
202C611-51/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: FLUORO-ELASTOMER; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Material: FLUOROELASTOMER;
202C642-51/164-0-CS1821
HEAT SHRINK BOOT; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUORO-ELASTOMER; Maximum Operating Temperature: 135 Cel;
202C663-51/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER;
202C621-51/164-0-CS1821
HEAT SHRINK BOOT; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
202C663-51-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Maximum Cable Entry: 2.15 inch; Minimum Cable Entry: .902 inch; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER;
202C632-51/86-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER;
202C611-51/164-0
HEAT SHRINK BOOT; Maximum Cable Entry: 18 inch; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
202C621-51/164-0
TE Connectivity's 202C621-51/164-0 heat shrink features FLUORO-ELASTOMER jacket material, with a min cable entry of 8.1" and max operating temperature of 135°C. Ideal for applications requiring high temperature resistance and protection for cables up to 0 AWG size with a max cable entry of 24".
202C632-51/164-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Material: FLUOROELASTOMER; Maximum Cable Entry: 1.142 inch; Jacket Material: FLUORO-ELASTOMER;
202C642-51/164-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Material: FLUOROELASTOMER; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER; Maximum Wire Size: 0 AWG;
202C663-51/164-0
HEAT SHRINK BOOT; Jacket Material: FLUORO-ELASTOMER; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Minimum Cable Entry: .902 inch;
202C611-51-0
HEAT SHRINK BOOT; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 4.8 inch; Jacket Material: FLUORO-ELASTOMER; Minimum Operating Temperature: -55 Cel;
202C621-51-0
HEAT SHRINK BOOT; Minimum Cable Entry: 8.1 inch; Maximum Cable Entry: 24 inch; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Jacket Material: FLUORO-ELASTOMER;
202C642-51-0
HEAT SHRINK BOOT; Maximum Cable Entry: 1.417 inch; Material: FLUOROELASTOMER; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER; Minimum Operating Temperature: -55 Cel;
202C653-51-0
HEAT SHRINK BOOT; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Cable Entry: 1.693 inch; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER;
202C632-71-0
TE Connectivity's 202C632-71-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min operating temp of -55°C. Ideal for applications requiring cable entry b/w 0.5" to 1.142", accommodating wire sizes up to 0 AWG.
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