Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 80 Cel; Construction: DUAL WALL;
Median Price
$6.350
Lifecycle Status
Suppliers In-Stock
7
In-Stock Inventory
1k+
Bürklin Elektronik
1+ parts
100+ parts
$4.630
1k+ parts
-
10k+ parts
Chip1Stop
$34.920
Verical
$4.930
$4.561
Nova Conductors
$6.010
Rapid Electronics
Vyrian
TME
$5.290
$4.960
Semicontronic
$4.190
$4.085
$4.064
Bastille Electronics
$5.710
$5.424
$5.349
Continental Prestige Electronics
$5.890
Assy Fe
Authorized Procurement Solutions
Argo Parts USA
Advanced Electronics
Heat Shrinks CGAT-9/3-0-STK attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EU2B-YS3303C
Idec
ROTARY SWITCH;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
NXP Semiconductors
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Bourns
ST3485EBDR
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
588742-000
TE Connectivity
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 24; Diameter: 5.95 mm; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
DR-25-2-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: CROSSLINKED ELASTOMER;
364129-000
TE Connectivity 364129-000 heat shrink with ELASTOMER jacket, suitable for cables up to 0 AWG. Operates b/w -75°C to 150°C, accommodating cable entries from 0.799" to 2.142". Ideal for various applications requiring durable and temperature-resistant cable protection.
HT-SCE-1/8-2.0-S1-0
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 225 Cel;
M83519/2-16
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
S02-03-RCS453
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
CWT-9005
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN;
382A023-3-42-0
TE Connectivity's 382A023-3-42-0 heat shrink features dual wall construction with polyolefin jacket material. It has a wide operating temperature range from -55°C to 135°C and accommodates wires up to 0 AWG. Ideal for electrical insulation in various applications.
M23053/5-108-4
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
HX-SCE-1K-6.4-50-S1-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
809S060-3H
Glenair
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN;
322A123-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel;
RNF-100-3/64-0-SP
TE Connectivity's RNF-100-3/64-0-SP is a single wall heat shrink tube made of polyolefin. It can withstand temperatures ranging from -55 to 135 °C and is suitable for use with 0 AWG wires. Ideal for various connector applications.
382A034-25/225-0
TE Connectivity's 382A034-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a wide operating temperature range from -75°C to 150°C and accommodates wire sizes up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature conditions.
M23053/5-110-0
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
RNF-100-1/4-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
M23053/5-108-9
Sumitomo Electric Industries
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
770-003S103W1
HEAT SHRINK BOOT; Jacket Material: ELASTOMER;
SO63-4-00
TE Connectivity SO63-4-00 heat shrink features single wall construction with crosslinked modified PVDF jacket. Solder terminal type, 150°C max operating temp, and 5.95mm diameter make it ideal for 0 AWG wire applications in various industries.
TMS-SCE-1-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CGAT-12/4-0-STK
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 80 Cel; Wire Gauge (AWG): 0; Minimum Operating Temperature: -30 Cel;
CGAT-18/6-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 80 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
CGAT-6/2-0-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 80 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0;
CGAT-12/4-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Operating Temperature: 80 Cel; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
CGAT-6/2-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 80 Cel; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL;
CGAT-9/3-0
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: DUAL WALL;
CGAT-R-9/3-0
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 80 Cel; Wire Gauge (AWG): 0; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG;
CGAT-9/3-0-100MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 80 Cel; Construction: DUAL WALL;
CGAT-9/3-0-60MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 80 Cel;
CGAT-3/1-0-100MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 80 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG;
CGAT-24/8-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 80 Cel;
CGAT-18/6-0-150MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 80 Cel; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
CGAT-R-KIT-1
CGAT-39/13-0-SP
CGAT-39/13-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 80 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -30 Cel;
CGAT-9/3-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 80 Cel;
CGAT-3/1-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 80 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL;
CGAT-18/6-0-SP
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 80 Cel; Minimum Operating Temperature: -30 Cel; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
CGAT-R-3/1-0
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 80 Cel;
CGAT-12/4-0-40MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 80 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: DUAL WALL; Minimum Operating Temperature: -30 Cel;
Supply Digital Components
$106.00
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12,000 In-Stock
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