Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
Median Price
$3.628
Lifecycle Status
Suppliers In-Stock
11
In-Stock Inventory
1k+
TE Connectivity
1+ parts
$3.550
100+ parts
-
1k+ parts
10k+ parts
DigiKey
$5.610
$3.380
Mouser Electronics
$4.810
TTI
$2.840
$2.070
Master Electronics
$3.150
$2.640
Verical
$3.706
$3.412
Nova Conductors
$2.516
Electro Enterprises
$3.210
$2.732
$2.214
FDH Electronics
$4.019
$3.420
$2.772
IBS Electronics
$4.454
$4.016
$3.733
Quittner & Schimek s.r.o.
Argo Parts USA
$2.349
Continental Prestige Electronics
$2.302
Aranea Global
$2.466
$2.367
Authorized Procurement Solutions
Advanced Electronics
Perfect Parts
Heat Shrinks NTFR-3/8-0-SP attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
NTFR-3/8-0-SP Connector Accessories trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
MC33269T-3.3G
Onsemi
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
RC0402FR-0710KL
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Nexperia
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
Goodwork Semiconductor
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
15118
Pro-power
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
641167-000
HEAT SHRINK BOOT; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
RNF-100-1/4-BN-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Maximum Wire Size: 0 AWG;
M23053/5-103-9
Defense Logistics Agency
HEAT SHRINK TUBE; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; IEC Conformity: NO; Construction: SINGLE WALL; MIL Conformity: NO;
RNF-100-3/32-CL-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
TMS-SCE-1K-3/8-2.0-4
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
S01-03-RCS293
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
M83519/2-18
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
809S060-2H
Glenair
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN;
M23053/5-103-0
Grayline
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO; IEC Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; DIN Conformity: NO;
RW-175-3/16-X-STK
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL;
TC-CAPS-4005-8
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN;
TMS-SCE-1K-1/2-2.0-4
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
202K1322501-225-0
TE Connectivity's 202K1322501-225-0 heat shrink features dual wall construction with elastomer jacket material. It offers a wide temperature range from -75°C to 150°C, accommodating wire sizes up to 0 AWG. Ideal for applications requiring a min cable entry of 5.9" and max of 15".
HTAT-48/13-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel;
DR-25-1/4-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Wire Gauge (AWG): 0;
202K132-25-G03/86-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER;
HSTTT08-48-Q
Panduit
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYTETRAFLUOROETHYLENE;
RNF-100-1/4-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
FIT-221-3/16CL007
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NTFR-3/4-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Wire Gauge (AWG): 0;
NTFR-5/8-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel;
NTFR-1/2-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
NTFR-1-1/4-0SPCS5633
HEAT SHRINK TUBE; Jacket Material: NEOPRENE; Construction: SINGLE WALL;
NTFR-1-1/4-0SPCS6680
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: NEOPRENE;
NTFR-1-1/4-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
NTFR-1/2-0-SP-CS7340
NTFR-1/2-0SPCS5984
NTFR-1/4-0SPCS5984
NTFR-1/4-0SPCS6705
NTFR-1-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -70 Cel; Construction: SINGLE WALL; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 121 Cel;
NTFR-1/8-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Maximum Wire Size: 0 AWG; Jacket Material: CHLORINATED POLYOLEFIN;
NTFR-3/16-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
NTFR-1-3/4-0-SP
HEAT SHRINK TUBE; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 121 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
NTFR-3/8-0-BULK-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CHLORINATED POLYOLEFIN; Wire Gauge (AWG): 0; Minimum Operating Temperature: -70 Cel;
NTFR-2-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 121 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -70 Cel; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
NTFR-3/4-0-BULK-SP
HEAT SHRINK BOOT; Minimum Operating Temperature: -70 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Jacket Material: CHLORINATED POLYOLEFIN; Wire Gauge (AWG): 0;
NTFR-3-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Construction: SINGLE WALL;
NTFR-5/8-0-BULK-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 121 Cel; Wire Gauge (AWG): 0; Minimum Operating Temperature: -70 Cel; Construction: SINGLE WALL;
NTFR-1/2-0-BULK-SP
HEAT SHRINK TUBE; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 121 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -70 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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