Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
Median Price
$10.020
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
TE Connectivity
1+ parts
100+ parts
-
1k+ parts
10k+ parts
DigiKey
$19.270
$13.116
TTI
$9.230
$7.340
Master Electronics
$9.180
$7.300
Verical
$10.800
Powell Electronics
$10.150
$8.530
Mouser Electronics
$8.360
$6.050
Nova Conductors
$5.500
FDH Electronics
$11.086
$9.435
$7.645
Vyrian
Aztec Data Supply Inc.
$4.975
Aranea Global
$5.390
$5.174
Continental Prestige Electronics
Authorized Procurement Solutions
Argo Parts USA
Heat Shrinks NTFR-1-1/4-0-SP attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
Secos
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
FIT-221-3/16CL002
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
RNF-100-1/8-0-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
382A023-3-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
S02-08-R-93
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Terminal Type: SOLDER;
770-003S103W1
HEAT SHRINK BOOT; Jacket Material: ELASTOMER;
HSTT100-C
Panduit
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
M83519/2-3
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
TMS-SCE-3/16-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
301A513-51/164-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Jacket Material: ELASTOMER; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel;
RNF-100-1/2-0-FSP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
CWT-9001
TE Connectivity's CWT-9001 heat shrink features single wall construction with crosslinked modified polyolefin jacket material. It supports wire gauge 18 AWG, suitable for discrete wire applications. Operating temperature ranges from -55 to 125°C, accommodating wires b/w 22 and 18 AWG efficiently.
ATUM-24/8-0-STK
Commscope
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
RW-175-1/8-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel;
ST18-5-9039
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
9556824001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 75 Cel; Construction: DUAL WALL;
382A012-12-0
HEAT SHRINK 2-WAY JUNCTION; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel; Jacket Material: FLUORO-ELASTOMER;
S03-03-R-100
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
M83519/2-8
Sumitomo Electric Industries
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE;
RNF-100-1-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
M23053/16-005-0
Ls Cable & System
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: ELASTOMER POLYOLEFIN; MIL Conformity: NO; DIN Conformity: NO; IEC Conformity: NO;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NTFR-3/8-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
NTFR-3/4-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Wire Gauge (AWG): 0;
NTFR-5/8-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel;
NTFR-1/2-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
NTFR-1-1/4-0SPCS5633
HEAT SHRINK TUBE; Jacket Material: NEOPRENE; Construction: SINGLE WALL;
NTFR-1-1/4-0SPCS6680
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: NEOPRENE;
NTFR-1/2-0-SP-CS7340
NTFR-1/2-0SPCS5984
NTFR-1/4-0SPCS5984
NTFR-1/4-0SPCS6705
NTFR-1-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -70 Cel; Construction: SINGLE WALL; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 121 Cel;
NTFR-1/4-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -70 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 121 Cel; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
NTFR-1/8-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Maximum Wire Size: 0 AWG; Jacket Material: CHLORINATED POLYOLEFIN;
NTFR-1-3/4-0-SP
HEAT SHRINK TUBE; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 121 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
NTFR-3/4-0-BULK-SP
HEAT SHRINK BOOT; Minimum Operating Temperature: -70 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Jacket Material: CHLORINATED POLYOLEFIN; Wire Gauge (AWG): 0;
NTFR-3-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -70 Cel; Maximum Operating Temperature: 121 Cel; Construction: SINGLE WALL;
NTFR-1-1/2-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -70 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 121 Cel; Jacket Material: CHLORINATED POLYOLEFIN;
NTFR-1/4-0-BULK-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 121 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -70 Cel;
NTFR-1-0-BULK-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 121 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -70 Cel; Wire Gauge (AWG): 0;
NTFR-1/2-0-BULK-SP
HEAT SHRINK TUBE; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 121 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -70 Cel;
Supply Digital Components
$106.00
$54.25
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$7.29
Quantity
12,000 In-Stock
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