Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 301A034-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for electrical insulation in various applications.
Median Price
$74.330
Lifecycle Status
Suppliers In-Stock
24
In-Stock Inventory
1k+
TTI Europe
1+ parts
$44.783
100+ parts
$39.770
1k+ parts
-
10k+ parts
TE Connectivity
$64.070
Master Electronics
$68.090
$53.160
$52.900
Farnell
$69.510
$56.050
Mouser Electronics
$59.080
TTI
DigiKey
$74.870
$54.102
Powell Electronics
$78.360
$63.610
Verical
$79.177
$63.859
Newark
$96.600
$80.650
Element14
$104.080
$87.680
PEI Genesis
Future Electronics
Nova Conductors
$44.455
Electro Sonic
$65.460
$39.520
$38.920
IBS Electronics
$95.878
$74.855
$74.489
Vyrian
VNN
Quittner & Schimek s.r.o.
Manoshevitz Elec. Sales
ACDS - Activité Composants Distribution Service
Speed Components Ltd
LWI Electronics Inc
Van Brakel Electronic
Continental Prestige Electronics
$34.790
Netroflash
Perfect Parts
Cyclops Electronics Ltd (Excess)
Assy Fe
Single wall construction provides a tight and secure fit when shrunk, ensuring protection and insulation for wires or cables.
Elastomer jacket material is known for its durability and flexibility, making it resistant to harsh environmental conditions and allowing for easy installation.
With a maximum operating temperature of 150°C, this heat shrink can handle high temperatures without deforming or losing its protective properties.
The low minimum operating temperature of -75°C ensures that the heat shrink remains effective even in extremely cold environments, providing consistent insulation.
Ability to accommodate wires up to 0 AWG allows this heat shrink to be used for a wide range of applications, from small gauge wires to larger cables.
Elastomer material offers excellent protection against chemicals, abrasion, and moisture, ensuring long-lasting performance and reliability for the wires or cables it covers.
Heat Shrinks 301A034-25-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Additional Features:
Connector Accessory Type:
Construction:
Jacket Material:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Wire Size:
PCN Design/Specification - 497802-000, 8200yy-000, 823692-000 Drawing 28/Apr/2014 Multiple Devices Drawing 19/Feb/2014
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
1N4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Synsemi
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
Silicon Standard
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
BSS138NH6327XTSA2
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
Ksl Microdevices
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
EU2B-YS3303C
Idec
ROTARY SWITCH;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
VERSAFIT-3/16-0-STK
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Additional Features: REFERENCE STANDARD: CSA; UL; Construction: SINGLE WALL;
TTMS-2.4-9
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL;
RPS-1K-16-10/2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG;
ATUM-9/3-0-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
FIT221-1/4-BLK
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
B-155-9005
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
FIT-221-1/16CL001
RNF-3000-3/1-9-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
RMW-63/19-1200/ADH-0
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel;
D-181-2222-90/9
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 22; Maximum Wire Size: 22 AWG; Maximum Operating Temperature: 150 Cel; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
M23053/5-103-0
Sumitomo Electric Industries
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; IEC Conformity: NO; DIN Conformity: NO; MIL Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN;
RNF-100-1/4-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
202K142-25/86-0
TE Connectivity's 202K142-25/86-0 is a dual wall heat shrink with an elastomer jacket material. It has a min cable entry of 7.1 inch and can withstand temperatures ranging from -75 to 150 °C. This heat shrink is commonly used in applications requiring insulation and protection for cables up to 0 AWG size, with a max cable entry of 17 inch.
M23053/16-003-0
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: ELASTOMER POLYOLEFIN; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL;
202K163-25-02-0
TE Connectivity's 202K163-25-02-0 heat shrink features single wall construction with elastomer jacket material. It has a min cable entry of 9.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 23".
HSTTV19-M
Panduit
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
S01-03-RCS681
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Diameter: 4.3 mm; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
B-155-9002
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
M23053/16-006-0
Ls Cable & System
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; Jacket Material: ELASTOMER POLYOLEFIN; Construction: SINGLE WALL; IEC Conformity: NO; DIN Conformity: NO;
RNF-100-1-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Additional Features: APPROVAL: VDE; Maximum Operating Temperature: 135 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
301A022-100/180-0
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 105 Cel;
301A512-51-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
301A514-50-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Operating Temperature: -55 Cel; Jacket Material: ELASTOMER;
301A011-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
301A034-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Construction: DUAL WALL;
301A513-51/164-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Jacket Material: ELASTOMER; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel;
301A022-25-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Additional Features: REFERENCE STANDARD: VG;
301A034-3/86-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
301A028-25-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
301A511-51/164-0
HEAT SHRINK 3-WAY JUNCTION; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER;
301A512-51/164-0
HEAT SHRINK 3-WAY JUNCTION; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
301A022-25-225-0
HEAT SHRINK 3-WAY JUNCTION; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
301A511-71-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
301A022-25/86-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Construction: DUAL WALL; Jacket Material: ELASTOMER;
301A512-71/86-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN;
301A011-25-0
HEAT SHRINK 3-WAY JUNCTION; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER;
301A048-25/225-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Construction: DUAL WALL;
301A048-25-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Construction: DUAL WALL; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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