Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
Median Price
$3.212
Lifecycle Status
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18
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1k+
Mouser Electronics
1+ parts
$3.940
100+ parts
$2.840
1k+ parts
$2.320
10k+ parts
$2.260
Element14
$144.226
$95.221
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Newark
$145.460
PEI Genesis
Master Electronics
$2.800
$2.230
Verical
$2.812
Boersig
Powell Electronics
$3.170
$2.570
Chip1Stop
$2.650
$2.590
Bristol Electronics
$2.664
$1.652
$0.879
Nova Conductors
$3.150
VNN
Quittner & Schimek s.r.o.
Rapid Electronics
$2.377
Dan-Mar Components
IBS Electronics
$4.783
$3.240
Vyrian
Electro Sonic
$2.680
$1.940
$1.770
Aranea Global
$3.087
$2.964
Argo Parts USA
Continental Prestige Electronics
$127.630
$117.930
Assy Fe
Heat Shrinks B-155-3809 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Maximum Operating Temperature:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Rugao Dachang Electronic
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
2N2222A
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
FIT-221-1/4WH103
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
MT1000-3/32-0-SP
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
S01-03-RCS293
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
M23053/5-107-0
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Additional Features: REFERENCE STANDARD: DEF; VDE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
M23053/16-004-0
Defense Logistics Agency
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; Jacket Material: ELASTOMER POLYOLEFIN; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL;
ATUM-40/13-0-STK
Commscope
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN;
462A011-25-0
TE Connectivity's 462A011-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for electrical insulation in various applications.
RT-375-3/8-X-65MM
222D232-3-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN;
M83519/2-14
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
VERSAFIT-3/16-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
222K121-25-00-0
TE Connectivity's 222K121-25-00-0 heat shrink features ELASTOMER jacket material, 0.41" min cable entry, and -75 to 150°C operating temp range. Ideal for applications requiring protection and insulation for cables up to 0 AWG with 0.94" max cable entry.
FIT-221-3/8BK103
HEAT SHRINK TUBE; Additional Features: CSA; UL; Jacket Material: POLYOLEFIN;
202K232-25-01/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG;
M23053/5-106-9
Ls Cable & System
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
FIT221-3/16-BLK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
S02-17-R-90
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 2.65 mm; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER;
B-155-3809
M23053/5-107-9
Grayline
HEAT SHRINK TUBE; MIL Conformity: NO; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; Construction: SINGLE WALL; IEC Conformity: NO;
M23053/5-108-0
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
B-155-07-S
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
B-155-3801
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
B-155-9002
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
B-155-9001
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
B-155-9003
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
B-155-07-100-18-9
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 18 AWG; Diameter: 7.3 mm; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 18;
B-155-00-01
B-155-9005
B-155-11-100-18-9
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 18 AWG; Wire Gauge (AWG): 18; Maximum Operating Temperature: 125 Cel;
B-155-11-S
B-155-3809-W1
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Cross Section Area: .4 mm2; Maximum Wire Size: 22 AWG; Wire Gauge (AWG): 22;
B-155-07
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Diameter: 7.3 mm;
B-155-11
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Diameter: 11.5 mm; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
B-155-4174-35-22-5/9-10
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG;
B-155-07-100-22-5
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 18 AWG; Wire Gauge (AWG): 18;
B-155-13
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Diameter: 15.1 mm; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
B-155-4174-35-22-5/9
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 125 Cel;
B-155-9004
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN;
B-155-03
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Diameter: 3 mm; Wire Gauge (AWG): 0;
B-155-3806-W1
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 22; Cross Section Area: .4 mm2; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 22 AWG;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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