Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The TE Connectivity 222K152-3-0 heat shrink features semi-rigid polyolefin jacket material. It has a min cable entry of 8.4" and can withstand temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG with a max cable entry of 20".
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$15.718
Netroflash
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Perfect Parts
Assy Fe
The use of semi-rigid polyolefin as the jacket material provides added durability and protection to the cables, making this product suitable for use in various environmental conditions.
The minimum cable entry size of 8.4 inches ensures compatibility with a wide range of cable sizes, allowing for flexibility in application.
With a high maximum operating temperature of 135°C, this product can withstand elevated temperatures without degrading, ensuring reliable performance in demanding environments.
The low minimum operating temperature of -55°C allows this product to function effectively in extremely cold conditions, making it suitable for a variety of applications.
The maximum wire size of 0 AWG indicates that this product can accommodate large wire gauges, providing versatility in cable management and organization.
The maximum cable entry size of 20 inches allows for the accommodation of larger cables, offering flexibility and convenience in installation and maintenance.
The use of polyolefin as the primary material ensures good electrical insulation properties and resistance to chemicals and abrasion, making this product a reliable choice for cable protection and management.
Heat Shrinks 222K152-3-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Maximum Cable Entry:
Minimum Cable Entry:
Connector Accessory Type:
Jacket Material:
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Maximum Operating Temperature:
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PCN Design/Specification - Mult Devs - material chg 24/MAR/2021
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
0460-202-16141
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBR130T1G
Onsemi
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Rugao Dachang Electronic
General Semiconductor
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
1N4148WSF-7
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
382A012-25-01/225-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
1202083-2
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 5.95 mm;
HSTT38-C
Panduit
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
M23053/5-104-9
Grayline
HEAT SHRINK TUBE; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO;
TMS-SCE-3/8-2.0-4
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
RT-375-3/4-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel;
878503-005
HEAT SHRINK BOOT; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
ATUM-8/2-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0; Construction: DUAL WALL; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
M83519/1-1
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
381A301-71/42-0
TE Connectivity's 381A301-71/42-0 heat shrink features dual wall construction with polyolefin jacket material. With a max operating temp of 135°C and min of -55°C, it accommodates wires up to 0 AWG. Ideal for electrical insulation in various applications.
HFT5000-60/30-0-310MM
HEAT SHRINK TUBE ; Construction: SINGLE WALL; Jacket Material: POLYESTER; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
462A023-25-G07/225-0
HEAT SHRINK 3-WAY JUNCTION; Jacket Material: ELASTOMER; Construction: DUAL WALL;
M23053/16-001-0
Defense Logistics Agency
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; IEC Conformity: NO; Construction: SINGLE WALL; Jacket Material: ELASTOMER POLYOLEFIN;
DR-25-1/2-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -75 Cel; Construction: SINGLE WALL;
M23053/4-303-0
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0;
RNF-100-3/4-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Additional Features: APPROVAL: VDE;
202F232-71/42-0
TE Connectivity's 202F232-71/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, -55 to 135 °C operating temp range, and 0.35" min cable entry. Ideal for applications requiring protection and insulation of wires with up to 0 AWG size and 0.961" max cable entry.
TMS-SCE-1/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
RNF-100-3/32-X-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
202K132-100/86-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
222K142-100/180-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 105 Cel; Maximum Cable Entry: 17 inch; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 7.1 inch;
222K142-100/184-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Maximum Cable Entry: 31 inch; Minimum Cable Entry: 19 inch;
222K132-25/225-0
TE Connectivity's 222K132-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 5.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size, with a max cable entry of 15".
222K132-25-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 5.9 inch; Maximum Cable Entry: 15 inch; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER;
222K132-25-00-0
TE Connectivity's 222K132-25-00-0 heat shrink features ELASTOMER jacket material, SINGLE WALL construction, and a 0.56" min cable entry. With a temperature range of -75 to 150°C, it accommodates up to 0 AWG wire size and 1.18" cable entry, ideal for various electrical applications.
222K121-25/225-0
HEAT SHRINK BOOT; Minimum Cable Entry: 5.6 inch; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 14 inch; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER;
222K142-25-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 7.1 inch; Jacket Material: ELASTOMER; Material: ELASTOMER;
222K142-25/225-0
TE Connectivity's 222K142-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It supports wire sizes up to 0 AWG, with a min cable entry of 7.1" and max of 17". Ideal for applications requiring temperature resistance from -75°C to 150°C.
222K132-25/225-0-CS6940
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
222K152-25/225-0
TE Connectivity's 222K152-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 8.4" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 20".
222K152-25-0
TE Connectivity's 222K152-25-0 heat shrink features single wall construction with elastomer jacket material. It has a min cable entry of 8.4" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max entry of 20".
222K121-25-00/225-0
TE Connectivity's 222K121-25-00/225-0 heat shrink features ELASTOMER jacket material, 0.41" min cable entry, and 150°C max operating temp. Ideal for applications requiring -75°C min operating temp and accommodating up to 0 AWG wire size with 0.94" max cable entry.
222K132-3/42-0
HEAT SHRINK BOOT; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Maximum Cable Entry: 15 inch; Minimum Operating Temperature: -55 Cel;
222K121-25-0
HEAT SHRINK BOOT; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 14 inch;
222K142-25-00-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Material: ELASTOMER; Minimum Cable Entry: 19 inch; Maximum Cable Entry: 31 inch; Minimum Operating Temperature: -75 Cel;
222K121-25-00-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Maximum Cable Entry: .94 inch;
222K152-25-G44/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
222K152-25L-0
TE Connectivity's 222K152-25L-0 heat shrink features ELASTOMER jacket material, -75 to 150 °C operating temp range, and fits cables up to 20" with 0 AWG wire size. Ideal for applications requiring durable cable protection in extreme temperature environments.
222K174-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Minimum Cable Entry: .618 inch; Maximum Cable Entry: 1.378 inch;
222K152-3/86-0
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN; Minimum Cable Entry: 8.4 inch; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 135 Cel;
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