Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; No. of Contacts: 10; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
Median Price
$3.091
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Suppliers In-Stock
9
In-Stock Inventory
1k+
Heilind Electronics
1+ parts
100+ parts
$2.870
1k+ parts
-
10k+ parts
Interstate Connecting
Powell Electronics
$2.750
Master Electronics
$2.560
$2.460
$2.430
Verical
$4.720
$3.985
TTI
$3.910
$3.060
Q Components
Bristol Electronics
Atlantic Semiconductor
Perfect Parts
Chip Carrier IC & Component Sockets 2-1393143-4 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
Number of Positions or Pins:
Installation Type:
IC Socket Type:
Housing Material:
Compatible Device Type:
2-1393143-4 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
SMMBT3904LT1G
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BAV99
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
1N4148WT
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
Changzhou Starsea Electronics
EU2B-YS2J03C
Idec
ROTARY SWITCH;
Bytesonic Electronics
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
150-10-640-00-106161
Preci-dip Sa
150-10-640-00-106161 by Preci-dip Sa is a DIP40 IC socket with 40 brass contacts, gold finish, and surface mount termination. It has a contact pitch of 0.1 inch and operates b/w -55°C to 125°C. Ideal for chip carrier ICs, this socket offers high insulation resistance and dielectric voltage withstand capabilities.
110-87-640-41-001101
110-87-640-41-001101 by Preci-dip Sa is a DIP40 IC socket with 40 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Tin termination. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for chip carrier applications.
D01-997.2042
Harwin Plc
Sockets and Chip Carriers;
ICF-624-F-O
Samtec
Samtec's ICF-624-F-O is a Chip Carrier IC Socket with 24 contacts, 15.24mm PCB row spacing, and liquid crystal polymer housing. It features gold flash over nickel contact finish, suitable for DIP24 devices in applications requiring a current rating of 1A and operating temperatures from -55°C to 125°C.
XR2A-1621-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
PY14QN2
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
SIM-AMS2
Phoenix Contact
RELAY SOCKET;
XR2A-1625
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
214-3339-00-0602
3m Electronic Products Division
IC SOCKET; Device Type Used On: ZIP14-DIP14; Housing Material: POLYSULFONE AND TORLON; No. of Contacts: 14;
214-44-316-01-670800
Mill-max Mfg
214-44-316-01-670800 by Mill-max Mfg is a NYLON46 chip carrier IC socket for DIP16 devices with 16 contacts and matte tin finish. It features a rectangular contact configuration, ideal for secure connections in electronic applications like PCBs and integrated circuits.
2-1437506-0
TE Connectivity
IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; No. of Contacts: 1; Termination Type: PRESS FIT;
110-93-320-41-801000
Mill-max Mfg's 110-93-320-41-801000 is a Chip Carrier IC Socket with 20 contacts made of Beryllium Copper. It features Tin/Lead finish with Nickel barrier, suitable for DIP20 devices. The rectangular contact configuration and plastic housing make it ideal for various electronic applications.
415-13-222-41-001000
Mill-max Mfg 415-13-222-41-001000 is a POLYETHYLENE IC SOCKET for SIP22 devices with 22 GOLD contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
ICA-628-STT
Samtec's ICA-628-STT is a DIP28 IC socket with 28 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It features polyester housing material, solder termination, and Tin finish for mating contacts. Ideal for applications requiring a current rating of 1A, operating temperatures from -65 to 125 °C, and dielectric voltage withstand of 1000VAC.
XR2H-2811-N
IC SOCKET; Manufacturer Series: XR2;
110-87-314-41-001101
110-87-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts and 7.62mm PCB row spacing. It features Beryllium Copper contact material, Gold Flash finish, and POLYESTER housing material. Ideal for applications requiring a current rating of 1A, dielectric voltage of 1400VAC, and operating temperatures from -55 to 125°C.
200-6311-9UN-1900
The 3M Electronic Products Division's 200-6311-9UN-1900 is a Chip Carrier IC Socket with POLYETHERSULFONE housing. It features 121 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) finish for PGA121 devices. Ideal for high-performance electronic applications requiring reliable connections.
18364
Vicor
IC SOCKET; Device Type Used On: SIP5; Maximum Operating Temperature: 120 Cel; No. of Contacts: 5; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2D-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
PYFZ-14-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
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Supply Digital Components
$106.00
$54.25
$11.90
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12,000 In-Stock
Total price ≈ $80,197.29
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