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RM2012A-103/603-PBVW10

Susumu

RM2012A-103/603-PBVW10 by Susumu

The Susumu RM2012A-103/603-PBVW10 is a thin film resistor array with 2 elements, offering 10000 ohm and 60000 ohm resistances. With a tolerance of 0.1%, it operates b/w -55 to 155 °C, making it suitable for AEC-Q200 automotive applications. Its compact SMT package measures 2mm x 1.25mm x 0.45mm, ideal for surface mount installations.

Median Price

$0.558

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 523 parts In-Stock

1+ parts

$0.558

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523

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Vyrian

USA . 7,128 parts In-Stock

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7,128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 25,387 parts In-Stock

1+ parts

$0.190

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$0.190

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Corohmni

South Africa . 180 parts In-Stock

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$0.308

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180

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Continental Prestige Electronics

USA . 5,396 parts In-Stock

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$0.558

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$0.547

5,396

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$0.547

Argo Parts USA

USA . 3,658 parts In-Stock

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$0.558

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$0.541

3,658

$0.558

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$0.541

Netroflash

USA . 1,000 parts In-Stock

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$0.558

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1,000

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AZTECH Wire

Italy . 1,655 parts In-Stock

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$12.567

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1,655

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Overview

Enhance your electronic devices with the RM2012A-103/603-PBVW10 resistor network by Susumu. Known for their top-notch quality and reliability, Susumu delivers a product that exceeds industry standards. This resistor network is perfect for various applications in the electronics industry, offering precision and stability. With a low power dissipation of 0.05 W and a temperature coefficient tracking of only 5 ppm/°C, this thin film technology resistor array ensures optimal performance. Trust Susumu to provide you with the best components for your projects, giving you peace of mind and ensuring your devices operate flawlessly.

Feature Benefit Bullets

Element Power Dissipation - 0.05 W

Low power consumption allows for efficient use of energy.

Rated Temperature - 85 °C

Suitable for operating within a wide temperature range.

Technology - THIN FILM

Thin film technology ensures precision and reliability.

Shape (Package) - RECTANGULAR PACKAGE

Rectangular shape allows for easy integration into circuit designs.

No. of Elements - 2

Having multiple elements allows for more versatility in circuit design.

Construction - Rectangular

Rectangular construction ensures uniformity and stability.

Packing Method - TR

TR packing method provides protection during transportation and storage.

Network Type - BUSSED

Bussed network type ensures efficient signal distribution.

No. of Terminals - 4

Having multiple terminals allows for easy connections in circuits.

Temperature Coef Tracking - 5 ppm/°C

Low temperature coefficient tracking ensures stability in different environments.

Package Style (Meter) - SMT

SMT package style makes it suitable for surface mount applications.

Terminal Shape - WRAPAROUND

Wraparound terminal shape ensures secure connections.

Maximum Operating Temperature - 155 °C

High maximum operating temperature allows for use in various conditions.

First Element Resistance - 10000 ohm

Having specific resistance values ensures accuracy in circuit design.

Minimum Operating Temperature - -55 °C

Low minimum operating temperature allows for use in colder environments.

Temperature Coef (ppm/°C) - 25

Temperature coefficient of 25 ensures stability in temperature variations.

Terminal Finish - MATTE TIN

Matte tin finish provides corrosion resistance and conductivity.

Second or Last Element Resistance - 60000 ohm

Having different resistance values allows for more customization in circuit design.

Height (Package) - 0.45 mm

Low height package allows for compact circuit designs.

Resistor Type - ARRAY/NETWORK RESISTOR

Array/network resistor type offers versatility for different circuit applications.

Tolerance - 0.1 %

Low tolerance ensures accuracy in resistance values.

Length (Package) - 2 mm

Compact length package allows for space-saving in circuit layouts.

Mounting Type - SURFACE MOUNT

Surface mounting type makes it easy to integrate into PCB designs.

Rated Power Dissipation (P) - 0.1 W

Higher rated power allows for handling higher power loads.

Reference Standard - AEC-Q200

Compliance with AEC-Q200 standard ensures reliability in automotive applications.

Width (Package) - 1.25 mm

Narrow width package allows for flexibility in placement on the circuit board.

Technical Specifications

Resistor Networks & Arrays RM2012A-103/603-PBVW10 attributes and parameters. Explore more Resistor Networks & Arrays devices from Susumu

Specs

Construction:

Rectangular

Element Power Dissipation:

.05 W

First Element Resistance:

10000 ohm

JESD-609 Code:

e3

Mounting Type:

Network Type:

BUSSED

No. of Elements:

2

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.45 mm

Length (Package):

2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistor Type:

Second or Last Element Resistance:

60000 ohm

Size Code:

0805

Sub-Category:

Array/Network Resistors

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Trade Compliance

RM2012A-103/603-PBVW10 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.20

SB

8533.21.00.25

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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