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RM2012B-103/303-PBVW10

Susumu

RM2012B-103/303-PBVW10 by Susumu

The Susumu RM2012B-103/303-PBVW10 is a thin film resistor array with 2 functions, 10000 ohm and 30000 ohm resistances. It has a tolerance of 0.1%, rated power dissipation of 0.1 W, and operates b/w -55 to 155 °C. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.

Median Price

$1.930

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,949 parts In-Stock

1+ parts

$1.930

100+ parts

$0.895

1k+ parts

$0.700

10k+ parts

$0.551

1,949

$1.930

$0.895

$0.700

$0.551

DigiKey

USA . 1,337 parts In-Stock

1+ parts

$1.930

100+ parts

$0.894

1k+ parts

$0.684

10k+ parts

$0.552

1,337

$1.930

$0.894

$0.684

$0.552

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 400 parts In-Stock

1+ parts

$0.558

100+ parts

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1k+ parts

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400

$0.558

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Vyrian

USA . 3,782 parts In-Stock

1+ parts

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3,782

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.760

10k+ parts

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2,000

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-

$0.760

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.975

10k+ parts

$0.900

2,000

-

-

$0.975

$0.900

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 13,007 parts In-Stock

1+ parts

$0.490

100+ parts

-

1k+ parts

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13,007

$0.490

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Corohmni

South Africa . 47 parts In-Stock

1+ parts

$0.558

100+ parts

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47

$0.558

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Argo Parts USA

USA . 6,919 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

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10k+ parts

$0.542

6,919

$0.558

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-

$0.542

Netroflash

USA . 4,000 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

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4,000

$0.558

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Continental Prestige Electronics

USA . 2,995 parts In-Stock

1+ parts

$0.558

100+ parts

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1k+ parts

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10k+ parts

$0.547

2,995

$0.558

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-

$0.547

Semicontronic

India . 3,888 parts In-Stock

1+ parts

$1.670

100+ parts

$1.628

1k+ parts

$1.620

10k+ parts

-

3,888

$1.670

$1.628

$1.620

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iodParts Technologies Inc.

India . 5,415 parts In-Stock

1+ parts

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5,415

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Perfect Parts

USA . 890 parts In-Stock

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890

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Overview

Enhance the performance of your electronic devices with the RM2012B-103/303-PBVW10 resistor network by Susumu. Crafted with precision using thin film technology, this isolated array resistor offers exceptional temperature coefficient tracking and a high level of accuracy with a tolerance of 0.1%. Ideal for a wide range of applications, from automotive to industrial electronics, this rectangular package resistor provides reliability and efficiency in a compact SMT design. Trust in Susumu's reputation for quality and innovation, and experience the value and benefits that the RM2012B-103/303-PBVW10 brings to your projects.

Feature Benefit Bullets

Element Power Dissipation: 0.05 W

Low power dissipation ensures efficient use of energy and helps in preventing overheating.

Rated Temperature: 85 °C

Can operate effectively at a wide range of temperatures, making it versatile for different environments.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Technology: THIN FILM

Thin film technology offers high precision and stability in resistance values.

Package: RECTANGULAR PACKAGE

The rectangular package shape is commonly used and allows for easy mounting and installation.

Maximum Operating Temperature: 155 °C

Can withstand high temperatures, making it suitable for demanding applications.

Tolerance: 0.1 %

High tolerance ensures accuracy and consistency in resistance values.

Mounting Type: SURFACE MOUNT

Surface mount technology enables easy assembly and occupies less space on the circuit board.

Technical Specifications

Resistor Networks & Arrays RM2012B-103/303-PBVW10 attributes and parameters. Explore more Resistor Networks & Arrays devices from Susumu

Specs

Construction:

Rectangular

Element Power Dissipation:

.05 W

First Element Resistance:

10000 ohm

JESD-609 Code:

e3

Mounting Type:

Network Type:

ISOLATED

No. of Elements:

1

No. of Functions:

2

No. of Terminals:

4

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.45 mm

Length (Package):

2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistor Type:

Second or Last Element Resistance:

30000 ohm

Size Code:

0805

Sub-Category:

Array/Network Resistors

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Trade Compliance

RM2012B-103/303-PBVW10 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.20

SB

8533.21.00.25

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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