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RM2012A-103/503-PBVW10

Susumu

RM2012A-103/503-PBVW10 by Susumu

The Susumu RM2012A-103/503-PBVW10 is a thin film resistor array with 0.05 W power dissipation, 10000 ohm first element resistance, and 50000 ohm second element resistance. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard compliance and high temperature coefficient tracking of 5 ppm/°C.

Median Price

$1.930

Lifecycle Status

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4

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1k+

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Mouser Electronics

USA . 837 parts In-Stock

1+ parts

$1.930

100+ parts

$0.895

1k+ parts

$0.612

10k+ parts

$0.551

837

$1.930

$0.895

$0.612

$0.551

DigiKey

USA . 695 parts In-Stock

1+ parts

$1.930

100+ parts

$0.894

1k+ parts

$0.684

10k+ parts

$0.552

695

$1.930

$0.894

$0.684

$0.552

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Nova Conductors

Japan . 765 parts In-Stock

1+ parts

$0.559

100+ parts

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765

$0.559

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Vyrian

USA . 693 parts In-Stock

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100+ parts

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1k+ parts

-

10k+ parts

-

693

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Aztec Data Supply Inc.

USA . 2,532 parts In-Stock

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$0.370

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10k+ parts

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2,532

$0.370

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Continental Prestige Electronics

USA . 4,856 parts In-Stock

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$0.559

100+ parts

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10k+ parts

$0.547

4,856

$0.559

-

-

$0.547

Argo Parts USA

USA . 2,358 parts In-Stock

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$0.559

100+ parts

-

1k+ parts

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10k+ parts

$0.542

2,358

$0.559

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-

$0.542

Corohmni

South Africa . 246 parts In-Stock

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$0.559

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246

$0.559

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Semicontronic

India . 636 parts In-Stock

1+ parts

$1.250

100+ parts

$1.219

1k+ parts

$1.212

10k+ parts

-

636

$1.250

$1.219

$1.212

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$0.547

1k+ parts

$0.531

10k+ parts

$0.519

50

-

$0.547

$0.531

$0.519

Overview

Looking for high-quality resistor networks and arrays? Look no further than the RM2012A-103/503-PBVW10 by Susumu. With a thin film technology and superior construction, this rectangular package offers precision and reliability for a variety of applications. From industrial machinery to consumer electronics, this bussed network resistor provides excellent temperature tracking and a low tolerance of 0.1%. Trust in Susumu's expertise and experience in manufacturing top-notch components to ensure optimal performance and longevity. Elevate your designs with the value and advantages that only Susumu can deliver.

Feature Benefit Bullets

Element Power Dissipation 0.05 W

With a low power dissipation, this resistor network is suitable for applications where energy efficiency is key.

Rated Temperature 85 °C

With a high rated temperature, this network can withstand high operating temperatures without compromising performance.

Technology THIN FILM

Utilizing thin film technology, this resistor network offers high precision and stability in various circuit applications.

Shape (Package) RECTANGULAR PACKAGE

The rectangular package design makes it easy to handle and install this resistor network in circuit boards efficiently.

No. of Elements 2

With two elements, this resistor network provides flexibility in circuit design and functionality.

Construction Rectangular

The rectangular construction ensures optimal space utilization and easy integration into circuit layouts.

Packing Method TR

The Tape and Reel packing method ensures convenient storage and handling of multiple resistor networks.

Size Code 0805

This size code indicates the dimensions of the resistor network, making it compatible with standard electronic components.

Network Type BUSSED

The bussed network type enables easy connection of multiple resistor elements, simplifying circuit design and layout.

No. of Terminals 4

With four terminals, this resistor network offers versatility in circuit connections and configurations.

Temperature Coef Tracking 5 ppm/°C

The low temperature coefficient tracking ensures stable and reliable performance across a wide range of operating temperatures.

Package Style (Meter) SMT

The Surface Mount Technology package style allows for easy and secure mounting of the resistor network on PCBs.

Terminal Shape WRAPAROUND

The wraparound terminal shape ensures secure and stable connections in circuit applications.

Maximum Operating Temperature 155 °C

With a high maximum operating temperature, this resistor network is suitable for demanding industrial applications.

First Element Resistance 10000 ohm

The first element resistance of 10000 ohms provides precise and accurate resistance values for circuit design.

Minimum Operating Temperature -55 °C

With a low minimum operating temperature, this resistor network can function reliably in harsh environmental conditions.

Temperature Coef (ppm/°C) 25

The temperature coefficient of 25 ppm/°C ensures minimal resistance drift in response to temperature changes.

Terminal Finish MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance for long-term reliability.

Second or Last Element Resistance 50000 ohm

The second or last element resistance of 50000 ohms offers high resistance values for specific circuit requirements.

Height (Package) 0.45 mm

With a low package height, this resistor network is suitable for applications with space constraints.

Resistor Type ARRAY/NETWORK RESISTOR

This resistor network is designed as an array/network resistor, offering multiple resistive elements in a single package.

Tolerance 0.1 %

With a low tolerance of 0.1%, this resistor network provides precise and accurate resistance values for critical applications.

Length (Package) 2 mm

The 2mm package length ensures compatibility with standard PCB layouts and dimensions.

Mounting Type SURFACE MOUNT

The surface mounting type allows for easy and secure installation of the resistor network on PCBs.

Rated Power Dissipation (P) 0.1 W

With a rated power dissipation of 0.1W, this resistor network can handle higher power loads without overheating.

Reference Standard AEC-Q200

This resistor network meets the AEC-Q200 standard, ensuring high reliability and performance in automotive applications.

Width (Package) 1.25 mm

The 1.25mm package width offers compatibility with various PCB layouts and designs.

Technical Specifications

Resistor Networks & Arrays RM2012A-103/503-PBVW10 attributes and parameters. Explore more Resistor Networks & Arrays devices from Susumu

Specs

Construction:

Rectangular

Element Power Dissipation:

.05 W

First Element Resistance:

10000 ohm

JESD-609 Code:

e3

Mounting Type:

Network Type:

BUSSED

No. of Elements:

2

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.45 mm

Length (Package):

2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistor Type:

Second or Last Element Resistance:

50000 ohm

Size Code:

0805

Sub-Category:

Array/Network Resistors

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Trade Compliance

RM2012A-103/503-PBVW10 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.20

SB

8533.21.00.25

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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