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RM2012A-103/303-PBVW10

Susumu

RM2012A-103/303-PBVW10 by Susumu

The Susumu RM2012A-103/303-PBVW10 is a thin film resistor array with 2 elements, 10000 ohm and 30000 ohm resistances. It has a tolerance of 0.1% and temperature coefficient tracking of 5 ppm/°C, making it ideal for precision applications in automotive electronics due to its AEC-Q200 reference standard compliance.

Median Price

$1.930

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,714 parts In-Stock

1+ parts

$1.930

100+ parts

$0.894

1k+ parts

$0.684

10k+ parts

$0.552

1,714

$1.930

$0.894

$0.684

$0.552

Mouser Electronics

USA . 880 parts In-Stock

1+ parts

$1.930

100+ parts

$0.895

1k+ parts

$0.612

10k+ parts

$0.551

880

$1.930

$0.895

$0.612

$0.551

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 350 parts In-Stock

1+ parts

$0.558

100+ parts

-

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350

$0.558

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Vyrian

USA . 1,417 parts In-Stock

1+ parts

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1,417

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Prism Electronics

USA . 34 parts In-Stock

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 19,992 parts In-Stock

1+ parts

$0.080

100+ parts

-

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19,992

$0.080

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Corohmni

South Africa . 50 parts In-Stock

1+ parts

$0.089

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50

$0.089

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Continental Prestige Electronics

USA . 6,329 parts In-Stock

1+ parts

$0.558

100+ parts

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10k+ parts

$0.547

6,329

$0.558

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$0.547

Argo Parts USA

USA . 1,673 parts In-Stock

1+ parts

$0.558

100+ parts

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$0.541

1,673

$0.558

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$0.541

Netroflash

USA . 550 parts In-Stock

1+ parts

$0.558

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550

$0.558

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Perfect Parts

USA . 710 parts In-Stock

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710

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Overview

Experience superior quality and reliability with the RM2012A-103/303-PBVW10 resistor network by Susumu. As a leader in thin film technology, Susumu guarantees top-notch performance and precision. Ideal for various applications, this rectangular package resistor array offers exceptional value with its high temperature coefficient tracking and low tolerance. With a wide temperature range and excellent power dissipation capabilities, this SMT resistor network is the perfect choice for demanding electronic circuits, ensuring optimal functionality and efficiency. Elevate your designs with the unmatched benefits and advantages of the Susumu RM2012A-103/303-PBVW10.

Feature Benefit Bullets

Element Power Dissipation: 0.05 W

Low power dissipation means this resistor network/array is efficient and won't generate excessive heat during operation.

Rated Temperature: 85 °C

With a high rated temperature, this resistor network/array can withstand a relatively wide range of operating temperatures, making it versatile and reliable in various environments.

Technology: THIN FILM

Thin film technology ensures high precision and stability in resistance values, making this product suitable for applications that require accurate and consistent performance.

Shape (Package): RECTANGULAR PACKAGE

The rectangular package shape allows for efficient layout and space-saving on circuit boards, making it ideal for compact electronic designs.

No. of Elements: 2

With two elements in the network, this resistor array can provide more flexible circuit configurations and precise resistance values for specific applications.

Packing Method: TR

The tape and reel packing method ensures easy handling and automated placement during assembly, improving manufacturing efficiency.

Maximum Operating Temperature: 155 °C

The high maximum operating temperature allows for reliable performance in demanding conditions, enhancing the durability and longevity of the product.

Tolerance: 0.1 %

With a low tolerance value, this resistor network/array provides accurate and consistent resistance values, crucial for precision electronic applications.

Mounting Type: SURFACE MOUNT

Being a surface mount component, this resistor array is easy to mount on circuit boards, saving space and facilitating automated assembly processes.

Technical Specifications

Resistor Networks & Arrays RM2012A-103/303-PBVW10 attributes and parameters. Explore more Resistor Networks & Arrays devices from Susumu

Specs

Construction:

Rectangular

Element Power Dissipation:

.05 W

First Element Resistance:

10000 ohm

JESD-609 Code:

e3

Mounting Type:

Network Type:

BUSSED

No. of Elements:

2

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.45 mm

Length (Package):

2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistor Type:

Second or Last Element Resistance:

30000 ohm

Size Code:

0805

Sub-Category:

Array/Network Resistors

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Trade Compliance

RM2012A-103/303-PBVW10 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.20

SB

8533.21.00.25

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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