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Z86E11F6

STMicroelectronics

Z86E11F6 by STMicroelectronics

Z86E11F6 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words, 124 RAM bytes, and operates at a speed of 8 rpm. It is ideal for industrial applications requiring UART connectivity and features TIMER(2) peripherals. The device has a supply voltage of 5V and can operate in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,944 parts In-Stock

1+ parts

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2,944

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Anansix

USA . 1,824 parts In-Stock

1+ parts

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1,824

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Digiode

USA . 1,425 parts In-Stock

1+ parts

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1,425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,759 parts In-Stock

1+ parts

$39.099

100+ parts

-

1k+ parts

$35.189

10k+ parts

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1,759

$39.099

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$35.189

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MKK Technologies

India . 1,325 parts In-Stock

1+ parts

$73.523

100+ parts

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1,325

$73.523

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DigiPath Technology Company

USA . 1,325 parts In-Stock

1+ parts

$73.523

100+ parts

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10k+ parts

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1,325

$73.523

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Corphita

USA . 2,741 parts In-Stock

1+ parts

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2,741

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Parana Technologies

USA . 736 parts In-Stock

1+ parts

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100+ parts

$46.749

1k+ parts

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736

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$46.749

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Overview

Unleash the power of innovation with the Z86E11F6 microcontroller by STMicroelectronics. Designed with precision and expertise, this device offers unmatched quality and reliability for a wide range of applications. Whether you're working on IoT projects, smart home devices, or industrial automation systems, this microcontroller delivers exceptional performance and versatility. Experience the seamless integration, high-speed connectivity, and advanced features that set this product apart from the rest. Elevate your projects to new heights with the Z86E11F6 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic body material provides good thermal conductivity and mechanical strength, making the product more reliable and durable.

Bit Size: 8

8-bit architecture allows for sufficient processing power for many embedded applications while keeping the cost low.

Power Supplies (V): 5

Operating at 5 volts is common in many electronics, ensuring compatibility with a wide range of devices and power sources.

No. of Terminals: 40

Having 40 terminals allows for more connectivity options and interfaces, making the microcontroller versatile for various projects.

Maximum Operating Temperature: 85 °C

Being able to operate at up to 85 °C makes it suitable for industrial applications where high temperatures may be present.

CPU Family: Z8

The Z8 CPU family is known for its low power consumption and efficient performance, making the microcontroller energy-efficient.

RAM Bytes: 124

With 124 bytes of RAM, the microcontroller can handle moderate data processing tasks smoothly.

Technology: MOS

MOS technology offers good speed and low power consumption, making the microcontroller energy-efficient and suitable for battery-powered applications.

Connectivity: UART

Having UART connectivity allows the microcontroller to communicate with other devices easily, expanding its compatibility and versatility.

Technical Specifications

Microcontrollers Z86E11F6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

Z8

JESD-30 Code:

R-XDIP-T40

JESD-609 Code:

e0

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

124

ROM Words:

4096

ROM Programmability:

UVPROM

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

30 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Data EEPROM Size:

0

Connectivity:

UART

Peripherals:

TIMER(2)

Trade Compliance

Z86E11F6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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