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VNW50N04A

STMicroelectronics

VNW50N04A by STMicroelectronics

STMicroelectronics VNW50N04A is a RECTANGULAR Peripheral Driver with built-in TRANSIENT, OVER CURRENT, and OVER VOLTAGE protections. It has 3 terminals in FLANGE MOUNT style with MATTE TIN finish. Ideal for BUFFER OR INVERTER BASED PERIPHERAL DRIVER applications due to its fast turn-on time of 3 us and sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,943 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,943

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-

-

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Vyrian

USA . 4,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,788

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-

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Anansix

USA . 1,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,556

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-

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LWI Electronics Inc

India . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 215 parts In-Stock

1+ parts

$3.104

100+ parts

-

1k+ parts

$2.794

10k+ parts

-

215

$3.104

-

$2.794

-

MKK Technologies

India . 1,720 parts In-Stock

1+ parts

$5.837

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$5.837

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-

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DigiPath Technology Company

USA . 1,720 parts In-Stock

1+ parts

$5.837

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$5.837

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-

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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13,000

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-

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Corphita

USA . 566 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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566

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Parana Technologies

USA . 111 parts In-Stock

1+ parts

-

100+ parts

$3.711

1k+ parts

-

10k+ parts

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111

-

$3.711

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-

Overview

Discover the STMicroelectronics VNW50N04A, a top-of-the-line peripheral driver designed to exceed your expectations. With built-in protections against transient events, over current, over voltage, and thermal issues, this rectangular package offers unmatched reliability. Whether you're in the automotive, industrial, or consumer electronics industry, this flange mount device with matte tin finish is perfect for your application needs. Trust in STMicroelectronics' proven track record of quality and innovation to deliver the performance and peace of mind you deserve. Choose the VNW50N04A for superior value and seamless integration into your designs.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate and mount in various equipment and devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple protection features ensure the safety and reliability of the connected peripherals and the driver itself.

No. of Terminals: 3

Having 3 terminals provides flexibility in connecting the driver to different peripherals or devices.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure and stable mounting in various applications.

Terminal Finish: MATTE TIN

Matte tin finish ensures good connectivity and long-term durability of the terminals.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection process.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and reliable connections.

Turn-on Time: 3 us

Fast turn-on time ensures quick response and operation of the driver.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type provides compatibility with a wide range of peripherals and devices.

Turn-off Time: 25 us

Reasonable turn-off time ensures smooth operation and transition for the connected peripherals.

Output Current Flow Direction: SINK

Sink output current flow direction makes it suitable for applications where peripherals need to sink current.

Technical Specifications

Peripheral Drivers VNW50N04A attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-XSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Output Current Flow Direction:

SINK

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

25 us

Turn-on Time:

3 us

Trade Compliance

VNW50N04A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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