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VNV20N0713TR

STMicroelectronics

VNV20N0713TR by STMicroelectronics

VNV20N0713TR by STMicroelectronics is a compact peripheral driver with a 20 A output peak current limit, ideal for MOS technology applications. It features built-in protections against transients, overcurrent, and thermal issues. With a fast turn-on time of 1.2 µs, it ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,957

-

-

-

-

Digiode

USA . 2,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,421

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-

-

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Anansix

USA . 1,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,547

-

-

-

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Pegasus Components GmbH

Germany . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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400

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,809 parts In-Stock

1+ parts

$4.293

100+ parts

-

1k+ parts

$3.863

10k+ parts

-

1,809

$4.293

-

$3.863

-

Ampacity Inc.

Singapore . 1,317 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

$4.500

-

-

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MKK Technologies

India . 696 parts In-Stock

1+ parts

$8.072

100+ parts

-

1k+ parts

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10k+ parts

-

696

$8.072

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-

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DigiPath Technology Company

USA . 696 parts In-Stock

1+ parts

$8.072

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$8.072

-

-

-

AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$8.560

100+ parts

-

1k+ parts

-

10k+ parts

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591

$8.560

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-

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Microchip USA

USA . 266 parts In-Stock

1+ parts

$24.231

100+ parts

-

1k+ parts

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10k+ parts

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266

$24.231

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-

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Corphita

USA . 3,605 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,605

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-

-

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Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

-

100+ parts

$5.133

1k+ parts

-

10k+ parts

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1,612

-

$5.133

-

-

Overview

Unlock superior performance with the VNV20N0713TR from STMicroelectronics, renowned for exceptional quality and innovation. This versatile peripheral driver excels in various applications, offering built-in protections that ensure reliability and safety. Experience rapid response times and efficient operation, making it an ideal choice for advanced engineering projects. Elevate your designs with a product backed by a trusted manufacturer, delivering unparalleled value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the durability and reliability of the driver in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern circuit boards, making it suitable for high-density applications.

Package Shape: RECTANGULAR

Rectangular package shape aids in efficient space utilization on the PCB, enhancing layout flexibility.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Integrated protection features improve the device's resilience against abnormal conditions, ensuring longer lifespans and reduced failures in critical applications.

No. of Terminals: 10

A 10-terminal configuration provides ample connections for versatile applications while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, making it a perfect fit for portable and compact electronic devices.

Terminal Position: DUAL

Dual terminal position facilitates more straightforward circuit routing and simplifies assembly on the PCB.

Maximum Seated Height: 3.75 mm

Low seated height contributes to a slim profile, allowing for more streamlined electronic designs.

Width: 7.5 mm

Compact width maximizes board space efficiency, providing designers with additional layout options.

Length: 9.4 mm

Short length ensures that it fits easily into tight spaces while still delivering robust performance.

Technology: MOS

MOS technology enables high-speed switching and energy efficiency, making it ideal for power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals promote effective soldering and facilitate better heat dissipation, improving device reliability.

Turn-on Time: 1.2 us

Fast turn-on time ensures rapid response to control signals, enhancing overall system performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows compatibility with a wide range of board designs and simplifies assembly.

Nominal Output Peak Current Limit: 20 A

A peak current limit of 20 A ensures robust performance in high-load applications, making it suitable for demanding peripheral tasks.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed specifically for buffer or inverter applications, this IC type provides versatility for various peripheral driving needs.

Turn-off Time: 10 us

A quick turn-off time enhances operational efficiency, minimizing delays in switching applications.

Output Current Flow Direction: SINK

The sink output current flow direction is advantageous for interfacing with common logic levels, simplifying design requirements.

Technical Specifications

Peripheral Drivers VNV20N0713TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G10

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

1.2 us

Width:

7.5 mm

Trade Compliance

VNV20N0713TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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