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VNQ5E160K-E

STMicroelectronics

VNQ5E160K-E by STMicroelectronics

VNQ5E160K-E by STMicroelectronics is a full bridge peripheral driver with a max supply voltage of 28V and built-in protections against overcurrent, thermal issues, and transients. It features a compact 24-terminal design for efficient surface mounting. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,366 parts In-Stock

1+ parts

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2,366

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Anansix

USA . 1,110 parts In-Stock

1+ parts

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1,110

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Digiode

USA . 710 parts In-Stock

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710

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 156 parts In-Stock

1+ parts

$2.424

100+ parts

-

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156

$2.424

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IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$9.668

100+ parts

-

1k+ parts

$8.701

10k+ parts

-

604

$9.668

-

$8.701

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AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$16.970

100+ parts

-

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251

$16.970

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MKK Technologies

India . 881 parts In-Stock

1+ parts

$18.181

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881

$18.181

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DigiPath Technology Company

USA . 881 parts In-Stock

1+ parts

$18.181

100+ parts

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881

$18.181

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iodParts Technologies Inc.

India . 3,464 parts In-Stock

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3,464

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Corphita

USA . 3,115 parts In-Stock

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3,115

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,576 parts In-Stock

1+ parts

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2,576

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Parana Technologies

USA . 2,175 parts In-Stock

1+ parts

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100+ parts

$11.560

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2,175

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$11.560

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Overview

Elevate your designs with the VNQ5E160K-E from STMicroelectronics, a trusted leader in semiconductor innovation. This robust peripheral driver is engineered for reliability, featuring built-in protections against thermal and overcurrent issues. Ideal for automotive and industrial applications, it ensures peak performance even under demanding conditions. Experience enhanced efficiency and peace of mind, knowing your projects are backed by quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy enhances the reliability and structural integrity of the device, making it suitable for various applications.

Surface Mount: YES

Being a surface-mount device allows for easier integration into compact electronic designs, saving space and simplifying assembly.

Maximum Supply Voltage: 28 V

The high maximum supply voltage offers flexibility in various power system designs and allows for higher performance operations.

Package Shape: RECTANGULAR

The rectangular shape helps optimize space on the PCB, making it easier to fit into tight layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

These built-in protections ensure reliable operation and longevity by safeguarding against voltage spikes and overheating.

Power Supplies (V): 8/28

The wide range of compatible power supply voltages makes this device adaptable for various applications requiring diverse input levels.

No. of Terminals: 24

With 24 terminals, this device provides sufficient connectivity options for complex peripheral interactions and enhances functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This design aids in efficient heat dissipation and allows for compact layouts in modern electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage expands compatibility with a variety of power sources, including battery-powered systems.

Terminal Position: DUAL

Dual terminal positioning can improve contact reliability and reduce circuit complexity, facilitating easier PCB design.

Maximum Seated Height: 2.45 mm

A low profile design allows for more compact assemblies, which is crucial in tight electronic environments.

Width: 7.5 mm

A compact width ensures this driver can fit into smaller traces and layouts, making it ideal for space-constrained applications.

Length: 10.3 mm

This length strikes a balance between space-saving design and effective functionality, ensuring better integration in diverse circuits.

Terminal Form: GULL WING

Gull wing terminals offer enhanced soldering capabilities, ensuring a strong mechanical and electrical connection to the PCB.

Nominal Supply Voltage: 13 V

Operating at a nominal supply voltage of 13 V is optimal for numerous applications, balancing performance and efficiency.

Turn-on Time: 15 us

A fast turn-on time enhances responsiveness of the driver, making it performant for high-speed applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm supports high-density packaging, enabling manufacturers to create more compact circuits.

Driver No. of Bits: 4

Having 4 bits allows for precise control over peripheral devices, enhancing versatility in various applications.

Interface IC Type: FULL BRIDGE BASED PERIPHERAL DRIVER

Full bridge design enables efficient control of connected devices, making it suitable for various robotic and automation applications.

Turn-off Time: 15 us

A quick turn-off time facilitates swift operation in dynamic environments, ensuring better performance in responsive systems.

Output Current Flow Direction: SOURCE

The source current flow direction allows for effective driving of loads, enhancing the versatility of the driver in various applications.

Technical Specifications

Peripheral Drivers VNQ5E160K-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G24

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

15 us

Turn-on Time:

15 us

Width:

7.5 mm

Trade Compliance

VNQ5E160K-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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