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VNQ5E050K-E

STMicroelectronics

VNQ5E050K-E by STMicroelectronics

VNQ5E050K-E by STMicroelectronics is a full bridge peripheral driver with a max supply voltage of 28V and built-in protections against overcurrent, thermal issues, and transients. It features a compact 24-terminal design for efficient surface mounting. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,372 parts In-Stock

1+ parts

-

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8,372

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Chip Stock

USA . 4,498 parts In-Stock

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4,498

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Digiode

USA . 2,973 parts In-Stock

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2,973

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Anansix

USA . 588 parts In-Stock

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588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,176 parts In-Stock

1+ parts

$13.433

100+ parts

-

1k+ parts

$12.090

10k+ parts

-

2,176

$13.433

-

$12.090

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AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$18.810

100+ parts

-

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866

$18.810

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MKK Technologies

India . 1,674 parts In-Stock

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$25.260

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-

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1,674

$25.260

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DigiPath Technology Company

USA . 1,674 parts In-Stock

1+ parts

$25.260

100+ parts

-

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1,674

$25.260

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Microchip USA

USA . 359 parts In-Stock

1+ parts

$28.629

100+ parts

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359

$28.629

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A-Z Elektronik GmbH

Germany . 5,690 parts In-Stock

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5,690

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Corphita

USA . 4,790 parts In-Stock

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4,790

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,150 parts In-Stock

1+ parts

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$16.061

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2,150

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$16.061

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Perfect Parts

USA . 1,756 parts In-Stock

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1,756

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Kepictronics

USA . 83 parts In-Stock

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83

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Overview

Unlock superior performance with the VNQ5E050K-E from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile peripheral driver ensures reliable operation across various applications, from automotive to industrial systems. With built-in protections against transient spikes and thermal overloads, you can trust its durability. Experience peace of mind and efficiency, knowing you're backed by a manufacturer renowned for quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's resilience and protection against environmental factors, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, making installation easier and facilitating higher-density configurations.

Maximum Supply Voltage: 28 V

A high maximum supply voltage provides flexibility for various applications, accommodating different operational requirements.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on circuit boards, allowing for efficient layout and integration with other components.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Incorporating multiple protection features ensures enhanced safety and longevity of the device, preventing damage from electrical faults.

Power Supplies (V): 8/28

Support for a range of power supply voltages allows this driver to be used in diverse applications with varying energy needs.

No. of Terminals: 24

With 24 terminals, this device provides ample connections for complex circuit designs, enhancing functionality and performance.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink design facilitate efficient thermal management and compact integration into space-constrained designs.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows for compatibility with a wider range of devices and applications, promoting versatility.

Terminal Position: DUAL

Dual terminal positioning simplifies layout design and allows for efficient routing on the circuit board, improving assembly processes.

Maximum Seated Height: 2.45 mm

The low seated height enhances the compactness of the design, making it suitable for use in low-profile applications.

Width: 7.5 mm

A narrow width allows the driver to fit into tighter spaces, making it suitable for modern, space-efficient designs.

Length: 10.3 mm

The optimized length contributes to a compact footprint, facilitating efficient use of PCB real estate.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and are easier to handle during assembly, contributing to overall product quality.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V indicates stable operation under standard conditions, ensuring reliable performance.

Turn-on Time: 20 us

The quick turn-on time enhances responsiveness in applications requiring immediate control, improving overall system performance.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enables high-density designs, allowing more components to fit within the available space on the PCB.

Driver No. of Bits: 4

With 4 bits, this driver can effectively control a variety of outputs, suitable for various application requirements.

Interface IC Type: FULL BRIDGE BASED PERIPHERAL DRIVER

The full bridge design allows for efficient control of motors and other loads, making it ideal for dynamic applications.

Turn-off Time: 35 us

A reasonably quick turn-off time improves the speed and efficiency of control, suitable for high-frequency applications.

Output Current Flow Direction: SOURCE

The source output current direction is suitable for driving loads directly, ensuring compatibility with various devices and applications.

Technical Specifications

Peripheral Drivers VNQ5E050K-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G24

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

35 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

VNQ5E050K-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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