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VNP35N07

STMicroelectronics

VNP35N07 by STMicroelectronics

VNP35N07 by STMicroelectronics is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has 3 terminals in a rectangular package style with open-drain output characteristics. Ideal for applications requiring a true sink output polarity and nominal peak current limit of 35A.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Vyrian

USA . 7,686 parts In-Stock

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Chip Stock

USA . 6,500 parts In-Stock

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Digiode

USA . 3,733 parts In-Stock

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Anansix

USA . 2,822 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Holdelec - ElecDif-Pro

France . 136 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 136 parts In-Stock

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J2 Sourcing AB

Sweden . 72 parts In-Stock

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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Euro-Tech

UK . 45 parts In-Stock

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Pegasus Components GmbH

Germany . 44 parts In-Stock

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LittleDiode

UK . 8 parts In-Stock

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Ampacity Inc.

Singapore . 900 parts In-Stock

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$4.500

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900

$4.500

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AZTECH Wire

Italy . 839 parts In-Stock

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$5.006

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839

$5.006

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

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$11.500

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$10.350

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1,657

$11.500

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$10.350

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$15.159

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$13.795

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$12.430

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$15.159

$13.795

$12.430

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MKK Technologies

India . 1,160 parts In-Stock

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$21.625

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$21.625

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DigiPath Technology Company

USA . 1,160 parts In-Stock

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$21.625

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$21.625

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Semicontronic

India . 1,261 parts In-Stock

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$34.500

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$33.638

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$33.465

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,625 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 7,497 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,030 parts In-Stock

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Continental Prestige Electronics

USA . 3,486 parts In-Stock

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Argo Parts USA

USA . 2,177 parts In-Stock

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Lixinc

USA . 1,765 parts In-Stock

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RC Electronics

USA . 1,458 parts In-Stock

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Parana Technologies

USA . 1,381 parts In-Stock

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$13.750

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

USA . 784 parts In-Stock

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784

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Overview

Unlock the power of precision and reliability with the VNP35N07 by STMicroelectronics. This high-quality peripheral driver offers built-in protections against transient events, overcurrent, overvoltage, and thermal issues, ensuring peace of mind for your projects. With its open-drain output characteristics and true output polarity, this product is perfect for a wide range of applications. Trust in STMicroelectronics' reputation for excellence and experience the value and benefits that the VNP35N07 brings to your designs. Make the smart choice today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for long-term use.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy installation and space-saving in compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The multiple built-in protections ensure the safety and reliability of the connected devices, offering peace of mind.

No. of Terminals: 3

With 3 terminals, this peripheral driver is easy to connect and integrate into existing systems without complexity.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting options and stability in various applications.

Output Characteristics: OPEN-DRAIN

The open-drain output allows for flexibility in connecting to a variety of devices, enhancing compatibility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures consistent performance over time.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the chances of wiring errors.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission, preventing any signal distortion or interference.

Technology: MOS

The MOS technology used in this peripheral driver offers high efficiency and low power consumption for energy-saving operation.

Technical Specifications

Peripheral Drivers VNP35N07 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

35 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Current:

.5 mA

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

16 us

Turn-on Time:

.8 us

Trade Compliance

VNP35N07 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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