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VNL5050S5-E

STMicroelectronics

VNL5050S5-E by STMicroelectronics

VNL5050S5-E by STMicroelectronics is a Power Management IC with 8 terminals, 5 V nominal voltage, and 3.5-5.5 V operating range. It comes in a small outline package with gull wing terminals suitable for power supply support circuits. With dimensions of 4.9mm x 3.9mm x 1.75mm, it can withstand peak reflow temperature of 245°C for up to 40 seconds, making it ideal for compact electronic devices requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 46,000 parts In-Stock

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46,000

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Digiode

USA . 4,902 parts In-Stock

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4,902

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Vyrian

USA . 4,332 parts In-Stock

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4,332

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Anansix

USA . 1,804 parts In-Stock

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1,804

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 644 parts In-Stock

1+ parts

$6.500

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-

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644

$6.500

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IDEA Electronic Components Group

UK . 1,969 parts In-Stock

1+ parts

$8.389

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-

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$7.550

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1,969

$8.389

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$7.550

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Microchip USA

USA . 345 parts In-Stock

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$9.769

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345

$9.769

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MKK Technologies

India . 494 parts In-Stock

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$15.774

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494

$15.774

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DigiPath Technology Company

USA . 494 parts In-Stock

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$15.774

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494

$15.774

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AZTECH Wire

Italy . 703 parts In-Stock

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$16.110

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703

$16.110

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Aztec Data Supply Inc.

USA . 3,453 parts In-Stock

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$20.147

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$20.147

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Corohmni

South Africa . 250 parts In-Stock

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$21.096

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$21.096

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Component Stockers USA

USA . 272 parts In-Stock

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$99.990

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$99.990

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Argo Parts USA

USA . 4,666 parts In-Stock

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Continental Prestige Electronics

USA . 3,189 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,873 parts In-Stock

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Perfect Parts

USA . 2,016 parts In-Stock

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2,016

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Lixinc

USA . 1,090 parts In-Stock

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Parana Technologies

USA . 1,067 parts In-Stock

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$10.030

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$10.030

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Aranea Global

USA . 100 parts In-Stock

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Kepictronics

USA . 47 parts In-Stock

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Overview

STMicroelectronics presents the VNL5050S5-E, a high-quality Power Management IC that offers unparalleled reliability and performance. With a focus on innovation and precision engineering, STMicroelectronics is a trusted manufacturer known for delivering top-notch solutions. The VNL5050S5-E is ideal for a wide range of applications, providing customers with unmatched value and benefits. Experience the advantage of superior power supply support circuitry in a compact and efficient package, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Surface mount components are easier to work with during assembly, and can lead to a more compact and efficient design.

Nominal Supply Voltage (Vsup): 5 V

This voltage is commonly used in many electronic devices, making this product compatible with a wide range of applications.

No. of Terminals: 8

Having more terminals allows for more connections and functions, increasing the versatility of the product.

Width (mm): 3.9 mm

The small width of the package makes it suitable for applications where space is limited, allowing for more flexibility in design.

Maximum Time At Peak Reflow Temperature (s): 40

This product can withstand higher temperatures for a longer period during the soldering process, ensuring a reliable connection.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the product has moderate sensitivity to moisture, suitable for most standard assembly processes.

Technical Specifications

Power Management ICs VNL5050S5-E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 1.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

VNL5050S5-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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