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VND7N0413TR

STMicroelectronics

VND7N0413TR by STMicroelectronics

VND7N0413TR by STMicroelectronics is a robust automotive peripheral driver featuring built-in protections against overcurrent, overvoltage, and thermal issues. It operates in extreme temperatures from -40 °C to 125°C and supports a nominal output peak current of 7A. Ideal for automotive applications, it utilizes MOS technology with an open-drain output characteristic.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,693 parts In-Stock

1+ parts

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3,693

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Digiode

USA . 1,277 parts In-Stock

1+ parts

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1,277

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Anansix

USA . 640 parts In-Stock

1+ parts

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640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 632 parts In-Stock

1+ parts

$2.391

100+ parts

-

1k+ parts

$2.152

10k+ parts

-

632

$2.391

-

$2.152

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MKK Technologies

India . 1,576 parts In-Stock

1+ parts

$4.496

100+ parts

-

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10k+ parts

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1,576

$4.496

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DigiPath Technology Company

USA . 1,576 parts In-Stock

1+ parts

$4.496

100+ parts

-

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1,576

$4.496

-

-

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AZTECH Wire

Italy . 549 parts In-Stock

1+ parts

$18.420

100+ parts

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549

$18.420

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Ampacity Inc.

Singapore . 1,054 parts In-Stock

1+ parts

$48.500

100+ parts

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1,054

$48.500

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Perfect Parts

USA . 5,010 parts In-Stock

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5,010

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Microchip USA

USA . 3,266 parts In-Stock

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3,266

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Corphita

USA . 2,374 parts In-Stock

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2,374

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Parana Technologies

USA . 2,093 parts In-Stock

1+ parts

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$2.859

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2,093

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$2.859

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Unlock unparalleled performance with the VND7N0413TR from STMicroelectronics! This premium peripheral driver combines robust thermal protection and versatility, making it ideal for automotive applications. Built to withstand extreme temperatures and engineered for reliability, it offers exceptional value with its efficient design and protective features. Elevate your projects by choosing a trusted manufacturer dedicated to quality and innovation—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental stresses, making the product suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for compact design and high-density circuit layouts, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating better integration into compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protections enhance reliability by safeguarding the device against common failure conditions, leading to prolonged operational life.

No. of Terminals: 2

The two-terminal design enables straightforward connections, simplifying the implementation in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced PCB footprint, allowing for more efficient use of space.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature increases versatility, allowing the product to be used in a wide range of environments, including automotive applications.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristic allows for easy connection with multiple devices on a single line, facilitating flexible circuit design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme conditions, which is particularly important in automotive applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and enhances corrosion resistance, essential for ensuring long-term reliability.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout, reducing potential for errors during soldering and assembly.

Maximum Seated Height: 2.4 mm

The low seated height contributes to the compactness of the device, making it suitable for space-constrained applications.

Width: 6.1 mm

A moderate width allows for efficient integration into narrow layouts while maintaining performance.

Output Polarity: TRUE

True output polarity makes it easier to interface with other components by consistently following established output logic.

Maximum Time At Peak Reflow Temperature: 30s

The ability to withstand peak reflow temperatures for extended durations ensures compatibility with automated assembly processes.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance offers improved durability during PCB manufacturing, ensuring consistent quality.

Length: 6.5 mm

The compact length supports efficient space management on PCBs without compromising performance.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring compliance with industry standards for reliability and performance.

Technology: MOS

MOS technology enables low power consumption while providing high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, making them ideal for surface mount applications.

Maximum Supply Current: 0.5 mA

Low supply current levels contribute to overall energy savings, making the driver suitable for battery-operated devices.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input provides improved noise immunity and signal integrity, ensuring reliable operation in noisy environments.

Turn-on Time: 0.5 µs

Fast turn-on time enhances performance by allowing rapid response in dynamic applications.

Terminal Pitch: 2.25 mm

The standard terminal pitch allows for compatibility with common PCB designs, facilitating easy integration.

Nominal Output Peak Current Limit: 7 A

A high peak current limit enables operation with powerful devices and loads, suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatility enables the driver to be used in various peripheral interfacing tasks, enhancing its application range.

Turn-off Time: 7 µs

Quick turn-off time contributes to efficient operation in pulse applications, ensuring responsiveness.

Output Current Flow Direction: SINK

Ability to sink current simplifies design in applications where drawing current from loads is required.

Technical Specifications

Peripheral Drivers VND7N0413TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

7 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.4 mm

Maximum Supply Current:

.5 mA

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

7 us

Turn-on Time:

.5 us

Width:

6.1 mm

Trade Compliance

VND7N0413TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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