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VND5E160AJ-E

STMicroelectronics

VND5E160AJ-E by STMicroelectronics

VND5E160AJ-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 36V and built-in protections against transient, overcurrent, thermal, and undervoltage. It features a low-profile design with 12 terminals for efficient integration. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 18,000 parts In-Stock

1+ parts

-

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18,000

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Vyrian

USA . 10,826 parts In-Stock

1+ parts

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1k+ parts

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10,826

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Sensible Micro Corp

USA . 3,002 parts In-Stock

1+ parts

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3,002

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Digiode

USA . 1,804 parts In-Stock

1+ parts

-

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1,804

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ComSIT Distribution GmbH

Germany . 855 parts In-Stock

1+ parts

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855

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Anansix

USA . 254 parts In-Stock

1+ parts

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254

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$6.619

100+ parts

-

1k+ parts

$5.957

10k+ parts

-

1,739

$6.619

-

$5.957

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$8.700

100+ parts

-

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10k+ parts

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292

$8.700

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Microchip USA

USA . 174 parts In-Stock

1+ parts

$11.675

100+ parts

-

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174

$11.675

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MKK Technologies

India . 1,830 parts In-Stock

1+ parts

$12.447

100+ parts

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1,830

$12.447

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DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$12.447

100+ parts

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1,830

$12.447

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Component Stockers USA

USA . 388 parts In-Stock

1+ parts

$99.990

100+ parts

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10k+ parts

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388

$99.990

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Corphita

USA . 3,188 parts In-Stock

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3,188

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Perfect Parts

USA . 1,456 parts In-Stock

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1,456

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Parana Technologies

USA . 522 parts In-Stock

1+ parts

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100+ parts

$7.914

1k+ parts

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10k+ parts

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522

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$7.914

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Overview

Unlock unparalleled performance with the VND5E160AJ-E from STMicroelectronics, a trusted leader in innovation. This advanced peripheral driver excels in efficiency and reliability, featuring robust built-in protections against transients, overcurrent, thermal issues, and undervoltage. Ideal for automotive, industrial, and consumer applications, it ensures seamless operation while minimizing downtime. Experience the peace of mind that comes with superior quality and support backed by STMicroelectronics' commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable performance in various environments, making this product suitable for long-term use.

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, enhancing overall space efficiency.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this driver can accommodate a wide range of applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout in circuit boards, optimizing space and ease of installation.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Incorporating multiple protection features ensures the device operates safely and reliably, reducing the risk of damage.

Power Supplies (V): 8/28

This wide range of voltage compatibility makes the driver versatile, suited for various power supply scenarios in different applications.

No. of Terminals: 12

The 12 terminals provide ample connectivity for various functions, making the implementation process more straightforward.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

This low-profile and compact package style takes up minimal space on the PCB, ideal for modern slim designs.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage allows for operation in low-power applications, making it energy-efficient.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures excellent solderability and long-term reliability, minimizing the risk of corrosion.

Terminal Position: DUAL

Having dual terminal positions enhances the flexibility in PCB layout, accommodating a variety of design needs.

Maximum Seated Height: 1.62 mm

The low maximum seated height contributes to a sleek profile, enabling the driver to fit well in space-constrained designs.

Width: 3.9 mm

The compact width allows for easy integration into tight spaces on a PCB, suitable for various applications.

Length: 4.9 mm

With a short length, this driver offers efficient layout options, minimizing board space usage.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support and ease of soldering, ensuring a reliable connection.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V is advantageous for applications requiring stable performance within a consistent operating range.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for closer spacing in PCB design, which is beneficial in densely populated layouts.

Driver No. of Bits: 2

With a 2-bit driver, this component can effectively manage simple logic or control tasks, adding to its versatility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based driver, it can enhance signal integrity and drive limited loads effectively, useful in various applications.

Output Current Flow Direction: SOURCE

The source output current flow direction is ideal for driving loads, providing robust performance in applications requiring current sourcing.

Technical Specifications

Peripheral Drivers VND5E160AJ-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VND5E160AJ-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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