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VND5E050MKTR-E

STMicroelectronics

VND5E050MKTR-E by STMicroelectronics

VND5E050MKTR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 28V and supports output currents up to 2A. It features built-in protections against transient, over/under voltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,745 parts In-Stock

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6,745

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Digiode

USA . 3,513 parts In-Stock

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3,513

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Anansix

USA . 1,176 parts In-Stock

1+ parts

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1,176

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ACDS - Activité Composants Distribution Service

France . 994 parts In-Stock

1+ parts

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994

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Bristol Electronics

USA . 994 parts In-Stock

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994

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Dan-Mar Components

USA . 994 parts In-Stock

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994

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Distributors (Availability)

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Microchip USA

USA . 412 parts In-Stock

1+ parts

$9.032

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412

$9.032

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AZTECH Wire

Italy . 1,183 parts In-Stock

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$9.610

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$9.610

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IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$10.705

100+ parts

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$9.635

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2,260

$10.705

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$9.635

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MKK Technologies

India . 2,310 parts In-Stock

1+ parts

$20.130

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2,310

$20.130

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DigiPath Technology Company

USA . 2,310 parts In-Stock

1+ parts

$20.130

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2,310

$20.130

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 2,376 parts In-Stock

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$12.800

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$12.800

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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iodParts Technologies Inc.

India . 994 parts In-Stock

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994

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Corphita

USA . 555 parts In-Stock

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555

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Overview

Unlock the potential of your projects with the VND5E050MKTR-E from STMicroelectronics. Renowned for its robust quality and advanced protection features, this peripheral driver excels in demanding applications. With built-in safeguards against thermal and voltage fluctuations, it ensures reliability and efficiency. Experience seamless integration and performance that enhances your designs, delivering unmatched value and peace of mind for your electronic innovations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it an excellent choice for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern electronic circuits.

Maximum Supply Voltage: 28 V

With a maximum supply voltage of 28 V, this product can support a wide range of applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating efficient layout and design.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Robust built-in protections enhance reliability and safeguard the device in varying conditions, reducing the risk of failure.

Power Supplies (V): 8/28

The flexible power supply range allows versatility in applications, catering to both low and high voltage requirements.

No. of Terminals: 24

Having 24 terminals provides extensive connectivity options, accommodating complex circuits and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package with heat sink features improves heat dissipation, ensuring performance stability under load.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage enhances compatibility with a variety of systems, making this product adaptable to different applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and oxidation resistance, ensuring a reliable connection in the circuit.

Terminal Position: DUAL

The dual terminal position facilitates easier PCB layout and optimal electrical performance.

Maximum Seated Height: 2.47 mm

A low seated height allows for compact designs, which is critical in space-constrained applications.

Width: 7.5 mm

The width of 7.5 mm strikes a balance between compactness and ease of handling during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds suggests compatibility with standard PCB assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with high-temperature processes, ensuring durability.

Length: 10.3 mm

The 10.3 mm length is optimal for tight-fit applications while maintaining a reliable electrical connection.

Maximum Output Current: 2 A

Supports a maximum output current of 2 A, making this driver suitable for powering various peripheral devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, ensuring reliable connections.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V makes this device ideal for common electronic applications, enhancing its usability.

Turn-on Time: 20 us

With a turn-on time of just 20 microseconds, this driver provides quick response, ideal for high-speed applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for denser layout configurations, maximizing space efficiency on the PCB.

Driver No. of Bits: 2

A 2-bit driver capability allows for versatile signaling and control options in various applications.

Moisture Sensitivity Level (MSL): 3

Being at MSL 3 indicates moderate moisture sensitivity, requiring standard handling precautions during assembly.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based driver, this product can effectively drive loads while maintaining signal integrity.

Turn-off Time: 45 us

A turn-off time of 45 microseconds ensures reliable operation by minimizing delay during shutdown sequences.

Output Current Flow Direction: SOURCE

Output current flowing from the device enhances versatility in driving various types of loads.

Technical Specifications

Peripheral Drivers VND5E050MKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

VND5E050MKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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