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VND5E050MK-E

STMicroelectronics

VND5E050MK-E by STMicroelectronics

VND5E050MK-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 28V, supporting up to 2A output current. It features built-in protections against transient, over/under voltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,644

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-

-

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Digiode

USA . 1,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,452

-

-

-

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Anansix

USA . 469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

469

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,056 parts In-Stock

1+ parts

$7.338

100+ parts

-

1k+ parts

$6.604

10k+ parts

-

2,056

$7.338

-

$6.604

-

AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$11.860

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$11.860

-

-

-

MKK Technologies

India . 347 parts In-Stock

1+ parts

$13.798

100+ parts

-

1k+ parts

-

10k+ parts

-

347

$13.798

-

-

-

DigiPath Technology Company

USA . 347 parts In-Stock

1+ parts

$13.798

100+ parts

-

1k+ parts

-

10k+ parts

-

347

$13.798

-

-

-

Microchip USA

USA . 246 parts In-Stock

1+ parts

$18.163

100+ parts

-

1k+ parts

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10k+ parts

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246

$18.163

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-

-

Corphita

USA . 2,434 parts In-Stock

1+ parts

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100+ parts

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2,434

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-

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Parana Technologies

USA . 1,959 parts In-Stock

1+ parts

-

100+ parts

$8.774

1k+ parts

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10k+ parts

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1,959

-

$8.774

-

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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350

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Overview

Elevate your project with the VND5E050MK-E from STMicroelectronics, a trusted leader in innovative solutions. This robust peripheral driver promises exceptional performance with built-in protections against transients and over-voltage, ensuring reliability in demanding applications. Its compact design and efficient power handling make it ideal for automotive and industrial uses, delivering unmatched value that enhances both functionality and longevity. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, making installation easier.

Maximum Supply Voltage: 28 V

A maximum supply voltage of 28V provides flexibility in various applications, accommodating higher voltage circuits.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space management on PCB layouts.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections enhance reliability and lifespan by safeguarding against electrical anomalies.

Power Supplies (V): 8/28

This wide range of supply voltages makes it adaptable to different power requirements.

No. of Terminals: 24

A sufficient number of terminals enables versatile connectivity options for various peripheral devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style is ideal for space-constrained applications while improving thermal management with heat sink/slugs.

Minimum Supply Voltage: 4.5 V

The lower limit of 4.5V allows this driver to function effectively in low-voltage applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish enhances solderability and corrosion resistance, improving manufacturing reliability.

Terminal Position: DUAL

Dual terminal positioning can facilitate better layout flexibility on printed circuit boards.

Maximum Seated Height: 2.47 mm

A low seated height is advantageous for low-profile designs, allowing for a thinner overall assembly.

Width: 7.5 mm

A compact width allows for higher density packing on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

A 30-second maximum ensures compatibility with modern soldering techniques and minimizes thermal stress on components.

Peak Reflow Temperature °C: 260

A high peak reflow temperature accommodates a variety of solder types, providing flexibility in manufacturing.

Length: 10.3 mm

A moderate length supports a good balance between size and performance, fitting well within standard PCB layouts.

Maximum Output Current: 2 A

A maximum output current of 2A supports a wide range of peripheral devices, making it versatile for various applications.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and improved mechanical strength.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V is optimum for many operational ranges, ensuring consistent performance.

Turn-on Time: 20 us

A rapid turn-on time enhances performance in fast-switching applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch enables tighter packing of components while maintaining manufacturability.

Driver No. of Bits: 2

Having a 2-bit driver makes it suitable for basic control applications, providing simplicity in design.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, guiding storage and handling requirements.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This IC type supports a variety of applications, ensuring broad compatibility and functionality.

Turn-off Time: 45 us

A quick turn-off time enhances efficiency and responsiveness in dynamic applications.

Output Current Flow Direction: SOURCE

Output current flowing from the driver allows for flexible interfacing with various components and systems.

Technical Specifications

Peripheral Drivers VND5E050MK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

VND5E050MK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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