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VND5E050MJTR-E

STMicroelectronics

VND5E050MJTR-E by STMicroelectronics

VND5E050MJTR-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 28V and supports output currents up to 2A. It features built-in protections against transient, over/under voltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,093 parts In-Stock

1+ parts

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100+ parts

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5,093

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ACDS - Activité Composants Distribution Service

France . 2,495 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,495

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Anansix

USA . 2,365 parts In-Stock

1+ parts

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1k+ parts

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2,365

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Digiode

USA . 1,379 parts In-Stock

1+ parts

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100+ parts

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1,379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,770 parts In-Stock

1+ parts

$5.664

100+ parts

-

1k+ parts

$5.097

10k+ parts

-

1,770

$5.664

-

$5.097

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Microchip USA

USA . 478 parts In-Stock

1+ parts

$6.252

100+ parts

-

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478

$6.252

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MKK Technologies

India . 2,236 parts In-Stock

1+ parts

$10.650

100+ parts

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2,236

$10.650

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DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$10.650

100+ parts

-

1k+ parts

-

10k+ parts

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2,236

$10.650

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-

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AZTECH Wire

Italy . 1,203 parts In-Stock

1+ parts

$21.270

100+ parts

-

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1,203

$21.270

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Component Stockers USA

USA . 713 parts In-Stock

1+ parts

$99.990

100+ parts

-

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713

$99.990

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Perfect Parts

USA . 5,475 parts In-Stock

1+ parts

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5,475

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Corphita

USA . 1,791 parts In-Stock

1+ parts

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1,791

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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1k+ parts

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900

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Parana Technologies

USA . 375 parts In-Stock

1+ parts

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100+ parts

$6.772

1k+ parts

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10k+ parts

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375

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$6.772

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Overview

Elevate your designs with the VND5E050MJTR-E from STMicroelectronics—a trusted leader in semiconductor innovation. This exceptional peripheral driver combines robust performance with built-in protections against transient, overvoltage, thermal, and undervoltage risks, ensuring reliable operation across various applications. Its compact, low-profile design allows for seamless integration, delivering unmatched value to engineers seeking quality and efficiency in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device (SMD), it allows for efficient use of board space and simplifies manufacturing processes.

Maximum Supply Voltage: 28 V

A maximum supply voltage of 28 V allows for flexibility in power supply options suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package design enables efficient layout on PCBs, maximizing space usage.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

These built-in protections enhance the reliability of the device by safeguarding against various electrical anomalies.

Power Supplies (V): 8/28

Supporting a wide range of supply voltages from 8 to 28 V makes this driver versatile for different circuit designs.

No. of Terminals: 12

With 12 terminals, this device offers adequate connections for signal and power management, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The small outline package with low profile design is excellent for compact applications without sacrificing performance.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for integration in low-voltage circuits, expanding its usability.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and reliability, ensuring robust connections.

Terminal Position: DUAL

Dual terminal positioning enhances the layout flexibility for PCB designers, promoting better design efficiency.

Maximum Seated Height: 1.62 mm

The low maximum seated height allows for a compact design, which is crucial in space-constrained applications.

Width: 3.9 mm

A slim width of 3.9 mm helps in fitting the driver into tight spaces on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

The specification allows for compatibility with standard soldering techniques, ensuring product consistency and quality.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the component can withstand soldering processes without damage.

Length: 4.9 mm

The compact length aids in minimizing overall device dimensions, making it suitable for space-sensitive applications.

Maximum Output Current: 2 A

The capability to handle a maximum output current of 2 A ensures effective signal driving capability in various applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easier handling during assembly and enhances solder joints.

Nominal Supply Voltage: 13 V

The nominal voltage of 13 V supports a wide range of typical operational conditions for electronic devices.

Turn-on Time: 20 us

A fast turn-on time of 20 µs enables quick signal response, which is important for real-time applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm aids in denser PCB layouts while maintaining manufacturability.

Driver No. of Bits: 2

A 2-bit driver allows for moderate complexity in applications, suitable for various digital signal applications.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 ensures standard handling procedures, increasing the practicality of assembly.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based driver, it is versatile for various applications involving signal conditioning and logic control.

Turn-off Time: 45 us

A turn-off time of 45 µs supports efficient signal termination, preventing signal integrity issues in high-speed applications.

Output Current Flow Direction: SOURCE

The ability to source current allows this driver to effectively drive other devices or circuits.

Technical Specifications

Peripheral Drivers VND5E050MJTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

3.9 mm

Trade Compliance

VND5E050MJTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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