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VND5E050MJ-E

STMicroelectronics

VND5E050MJ-E by STMicroelectronics

VND5E050MJ-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 28V and can handle up to 2A output current. It features built-in protections against transient, over/under voltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,978 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,978

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-

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Digiode

USA . 4,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,369

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Anansix

USA . 1,727 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,727

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 983 parts In-Stock

1+ parts

$6.825

100+ parts

-

1k+ parts

$6.142

10k+ parts

-

983

$6.825

-

$6.142

-

MKK Technologies

India . 129 parts In-Stock

1+ parts

$12.833

100+ parts

-

1k+ parts

-

10k+ parts

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129

$12.833

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-

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DigiPath Technology Company

USA . 129 parts In-Stock

1+ parts

$12.833

100+ parts

-

1k+ parts

-

10k+ parts

-

129

$12.833

-

-

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AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$15.050

100+ parts

-

1k+ parts

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10k+ parts

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895

$15.050

-

-

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Microchip USA

USA . 318 parts In-Stock

1+ parts

$28.263

100+ parts

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10k+ parts

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318

$28.263

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-

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Corphita

USA . 3,397 parts In-Stock

1+ parts

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3,397

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Parana Technologies

USA . 2,224 parts In-Stock

1+ parts

-

100+ parts

$8.160

1k+ parts

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10k+ parts

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2,224

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$8.160

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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100+ parts

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350

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Overview

Elevate your designs with the VND5E050MJ-E from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality peripheral driver guarantees reliability with built-in protections against transients, overvoltage, and thermal issues, ensuring optimal performance in demanding applications. With its compact design and exceptional power handling, it empowers engineers to create efficient, robust systems—offering unmatched value and peace of mind for every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This robust package material ensures durability and resistance to environmental stress, making it ideal for various applications.

Surface Mount: YES

The surface mount capability facilitates compact design and easy integration into modern PCBs.

Maximum Supply Voltage: 28 V

A high maximum supply voltage allows this driver to be used in a wide range of applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on circuit boards.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability and longevity, safeguarding against common electrical fault conditions.

Power Supplies (V): 8/28

Supporting a broad range of supply voltages makes this driver suitable for various power systems.

No. of Terminals: 12

The 12-terminal design allows for greater connectivity options, enabling more complex circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The low-profile design helps in saving space, making it perfect for compact applications.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage expands compatibility with various power sources, improving usability.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: DUAL

The dual terminal position enables easier layout options, streamlining the design process.

Maximum Seated Height: 1.62 mm

A low seated height provides flexibility in design, crucial for space-constrained environments.

Width: 3.9 mm

A compact width allows for higher density designs on circuit boards, optimizing space.

Maximum Time At Peak Reflow Temperature (s): 30

A longer time at peak temperature ensures complete solder joint formation without damaging the component.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures makes it compatible with lead-free soldering processes.

Length: 4.9 mm

The short length contributes to a compact form factor, further aiding in space optimization on PCBs.

Maximum Output Current: 2 A

A maximum output current of 2 A enables this driver to effectively control a variety of peripherals.

Terminal Form: GULL WING

The gull wing terminal form provides good mechanical strength and ease of soldering.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V is beneficial for standard operational conditions, ensuring reliability.

Turn-on Time: 20 us

A fast turn-on time improves the responsiveness of connected devices, enhancing performance.

Terminal Pitch: 0.8 mm

The 0.8 mm pitch allows for high-density designs while maintaining reliable connections.

Driver No. of Bits: 2

The 2-bit driver configuration supports simple control logic, suitable for a range of applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, suitable for most standard manufacturing processes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface type can be used in various driver applications, enhancing its utility.

Turn-off Time: 45 us

A swift turn-off time improves control over connected loads, enhancing operational efficiency.

Output Current Flow Direction: SOURCE

Output current sourcing capability allows for effective management of power delivery to external components.

Technical Specifications

Peripheral Drivers VND5E050MJ-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

3.9 mm

Trade Compliance

VND5E050MJ-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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