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VND5E050AKTR-E

STMicroelectronics

VND5E050AKTR-E by STMicroelectronics

VND5E050AKTR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 28V, supporting up to 2A output current. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,445 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,445

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Digiode

USA . 1,461 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,461

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PC Components Company LLC

USA . 850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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850

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Bristol Electronics

USA . 850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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850

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Anansix

USA . 589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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589

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,791 parts In-Stock

1+ parts

$11.240

100+ parts

-

1k+ parts

$10.116

10k+ parts

-

1,791

$11.240

-

$10.116

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Microchip USA

USA . 302 parts In-Stock

1+ parts

$12.426

100+ parts

-

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302

$12.426

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AZTECH Wire

Italy . 1,101 parts In-Stock

1+ parts

$17.510

100+ parts

-

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1,101

$17.510

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MKK Technologies

India . 1,481 parts In-Stock

1+ parts

$21.135

100+ parts

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10k+ parts

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1,481

$21.135

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DigiPath Technology Company

USA . 1,481 parts In-Stock

1+ parts

$21.135

100+ parts

-

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1,481

$21.135

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Component Stockers USA

USA . 349 parts In-Stock

1+ parts

$99.990

100+ parts

-

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349

$99.990

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Kepictronics

USA . 20,000 parts In-Stock

1+ parts

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20,000

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Parana Technologies

USA . 1,376 parts In-Stock

1+ parts

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100+ parts

$13.439

1k+ parts

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1,376

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$13.439

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Perfect Parts

USA . 1,073 parts In-Stock

1+ parts

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1,073

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iodParts Technologies Inc.

India . 850 parts In-Stock

1+ parts

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1k+ parts

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850

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Corphita

USA . 324 parts In-Stock

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324

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Overview

Unlock unparalleled performance with the VND5E050AKTR-E from STMicroelectronics, a leader in innovative solutions. This robust peripheral driver ensures exceptional reliability across diverse applications, thanks to its built-in protections against transients, overcurrent, and thermal issues. Designed for seamless integration, it delivers efficient power management with minimal footprint, making it perfect for automotive and industrial systems. Experience quality you can trust and elevate your projects with this versatile component that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures protection against environmental factors, enhancing reliability.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, maximizing PCB space efficiency.

Maximum Supply Voltage: 28 V

A high maximum supply voltage accommodates a wide range of applications, making it versatile for different use cases.

Package Shape: RECTANGULAR

Rectangular packaging optimizes the layout on printed circuit boards (PCBs), enabling efficient design.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections enhance device longevity and reliability, preventing damage from common electrical issues.

Power Supplies: 8/28 V

Flexible power supply options support various operational requirements, offering designers greater versatility.

No. of Terminals: 24

With 24 terminals, this device provides ample connectivity for complex applications, improving functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

An optimized package style allows for effective thermal management while maintaining a compact footprint.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for operation in battery-powered and low-voltage applications, enhancing adaptability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position supports easier layout designs and enhances connectivity options on PCBs.

Maximum Seated Height: 2.45 mm

A low seated height aids in keeping the overall profile of the device slim, beneficial for compact implementations.

Width: 7.5 mm

A narrow width offers flexibility in design layouts without taking up excessive PCB space.

Maximum Time At Peak Reflow Temperature: 30 s

This specification supports reliable solder reflow processes, ensuring robust connections during assembly.

Peak Reflow Temperature: 260 °C

High peak reflow temperature compatibility ensures that the device can withstand the assembly process without damage.

Length: 10.3 mm

A well-defined length allows for effective fitting in various designs and applications.

Maximum Output Current: 2 A

The ability to handle a maximum output current of 2 A makes this driver capable of supporting demanding peripherals.

Technology: CMOS

CMOS technology offers low power consumption with high speed, making this driver efficient for peripheral applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates excellent soldering and mechanical strength, enhancing reliability.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V enables optimal performance characteristics in a range of applications.

Turn-on Time: 20 µs

Fast turn-on time allows for quick response to commands, improving overall system performance.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for dense layout designs without sacrificing solderability and reliability.

Driver No. of Bits: 2

A 2-bit driver provides flexibility in controlling multiple peripherals while minimizing complexity.

Moisture Sensitivity Level: 3

With a moisture sensitivity level of 3, this device is suitable for standard handling procedures, simplifying integration.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Suitable for buffering and inverting applications, making it adaptable to various design needs.

Turn-off Time: 45 µs

A quick turn-off time contributes to faster operation in high-frequency applications, enhancing efficiency.

Output Current Flow Direction: SINK

The sinking output current capability allows for easier integration with common system architectures.

Technical Specifications

Peripheral Drivers VND5E050AKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

VND5E050AKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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