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VND5E025AY-E

STMicroelectronics

VND5E025AY-E by STMicroelectronics

VND5E025AY-E by STMicroelectronics is a 36-terminal peripheral driver with power supplies of 8-28V. It features a small outline package and gull wing terminals with 0.5mm pitch. Ideal for buffer or inverter-based interface IC applications requiring high-performance drivers in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,460

-

-

-

-

Digiode

USA . 3,043 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,043

-

-

-

-

Anansix

USA . 615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

615

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,109 parts In-Stock

1+ parts

$2.385

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

$2.385

-

-

-

IDEA Electronic Components Group

UK . 575 parts In-Stock

1+ parts

$3.044

100+ parts

-

1k+ parts

$2.740

10k+ parts

-

575

$3.044

-

$2.740

-

MKK Technologies

India . 1,557 parts In-Stock

1+ parts

$5.725

100+ parts

-

1k+ parts

-

10k+ parts

-

1,557

$5.725

-

-

-

DigiPath Technology Company

USA . 1,557 parts In-Stock

1+ parts

$5.725

100+ parts

-

1k+ parts

-

10k+ parts

-

1,557

$5.725

-

-

-

AZTECH Wire

Italy . 837 parts In-Stock

1+ parts

$10.680

100+ parts

-

1k+ parts

-

10k+ parts

-

837

$10.680

-

-

-

Corphita

USA . 4,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 1,101 parts In-Stock

1+ parts

-

100+ parts

$3.640

1k+ parts

-

10k+ parts

-

1,101

-

$3.640

-

-

Overview

Unlock the potential of your electronic designs with the VND5E025AY-E peripheral driver by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers cutting-edge solutions that exceed industry standards. This versatile component is perfect for a wide range of applications, providing seamless integration and exceptional performance. Experience the value and benefits of this premium product, offering unmatched efficiency and precision to meet all your project needs. Trust STMicroelectronics to elevate your designs to the next level with the VND5E025AY-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards, saving time and space.

Package Shape: RECTANGULAR

The rectangular shape is commonly used for electronic components, making it easy to integrate this peripheral driver into existing systems.

Power Supplies (V): 8/28

The wide range of power supply options allows for flexibility in different applications, accommodating a variety of voltage requirements.

No. of Terminals: 36

Having a higher number of terminals enables the peripheral driver to connect to multiple devices or components, increasing versatility and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the circuit board and reduces overall system size, ideal for compact electronic designs.

Terminal Position: DUAL

Dual terminal positions provide redundancy and improve connectivity, ensuring a stable and reliable connection in the system.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and solder joint reliability, enhancing the durability and performance of the peripheral driver.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and precise connection, enabling efficient use of space on the circuit board.

Driver No. of Bits: 2

The two bits driver provides sufficient capacity for processing data and signals, meeting the requirements of most peripheral driver applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The choice between buffer or inverter-based interface ICs offers flexibility in designing and customizing the peripheral driver for specific application needs.

Technical Specifications

Peripheral Drivers VND5E025AY-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G36

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/28

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

VND5E025AY-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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