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VND5004CSP30TR-E

STMicroelectronics

VND5004CSP30TR-E by STMicroelectronics

VND5004CSP30TR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 27V and operates in extreme temps from -40 °C to 150 °C. It features built-in protections against transient, over/under voltage, ensuring reliability. Ideal for automotive applications, it supports efficient signal buffering or inversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,672 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,672

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Digiode

USA . 3,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,050

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Anansix

USA . 1,010 parts In-Stock

1+ parts

-

100+ parts

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1,010

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,029 parts In-Stock

1+ parts

$3.110

100+ parts

-

1k+ parts

$2.799

10k+ parts

-

1,029

$3.110

-

$2.799

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MKK Technologies

India . 454 parts In-Stock

1+ parts

$5.847

100+ parts

-

1k+ parts

-

10k+ parts

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454

$5.847

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DigiPath Technology Company

USA . 454 parts In-Stock

1+ parts

$5.847

100+ parts

-

1k+ parts

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10k+ parts

-

454

$5.847

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-

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Microchip USA

USA . 2,805 parts In-Stock

1+ parts

$6.683

100+ parts

-

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10k+ parts

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2,805

$6.683

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-

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AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$10.990

100+ parts

-

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10k+ parts

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274

$10.990

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Corphita

USA . 3,909 parts In-Stock

1+ parts

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3,909

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Parana Technologies

USA . 1,507 parts In-Stock

1+ parts

-

100+ parts

$3.718

1k+ parts

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10k+ parts

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1,507

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$3.718

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Overview

Elevate your designs with the VND5004CSP30TR-E from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This robust peripheral driver excels in reliability with built-in protections against transients, over-voltage, and thermal issues, making it ideal for automotive applications. Enjoy peace of mind knowing you're backed by a manufacturer renowned for innovation and quality, ensuring seamless performance while maximizing efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact designs, providing flexibility in PCB layout.

Maximum Supply Voltage: 27 V

A high maximum supply voltage allows compatibility with a wider range of power systems, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, facilitating better layout design.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance reliability and safeguard against electrical faults, reducing the risk of damage.

No. of Terminals: 30

A higher number of terminals allows for more functions and connections, making the product suitable for complex applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline and heat sink/slug design aid in effective heat dissipation, allowing for reliable operation under heavy loads.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage enhances compatibility with various devices and systems powered by battery or low-voltage sources.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating ensures reliability and performance in demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

Operating at low temperatures makes this product suitable for a wide range of environments, including extreme conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in connections, allowing for better design adaptability.

Maximum Seated Height: 2.35 mm

A low seated height contributes to a compact design, which is ideal for space-constrained applications.

Width: 16 mm

Moderate width makes it versatile for different application layouts, accommodating various PCB sizes.

Output Polarity: TRUE

True output polarity provides consistent signal integrity, enhancing reliable communication in peripheral driver applications.

Length: 17.2 mm

This length strikes a balance between size and functionality, making it easy to fit into various PCB designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grading ensures suitability for use in vehicles, where components must withstand harsh conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate ease of soldering and assembly, improving manufacturing efficiency and reliability.

Maximum Supply Current: 6 mA

A low maximum supply current contributes to energy efficiency, making it a good choice for battery-operated devices.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a variety of input signals and devices.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V aligns well with automotive and other power systems, ensuring optimal performance.

Terminal Pitch: 1 mm

A 1 mm terminal pitch allows for a compact design while maintaining sufficient spacing for reliable solder connections.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter type peripheral driver enhances its applicability in various signal conditioning roles.

Output Current Flow Direction: SINK

The sink output current direction is suitable for driving loads efficiently, especially useful in applications where low-side switching is required.

Technical Specifications

Peripheral Drivers VND5004CSP30TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Additional Features:

TERM PITCH-MIN

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G30

Length:

17.2 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.75,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.35 mm

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

27 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Trade Compliance

VND5004CSP30TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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