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VND5004BSP30TR-E

STMicroelectronics

VND5004BSP30TR-E by STMicroelectronics

VND5004BSP30TR-E by STMicroelectronics is a versatile peripheral driver with a max output current of 15 A, supporting power supplies from 8 to 24 V. Its compact SO package and dual terminal design enhance integration in space-constrained applications. Ideal for buffer or inverter-based systems, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,675

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-

-

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Anansix

USA . 2,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,833

-

-

-

-

Digiode

USA . 2,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,661

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,309 parts In-Stock

1+ parts

$8.511

100+ parts

-

1k+ parts

$7.660

10k+ parts

-

1,309

$8.511

-

$7.660

-

Microchip USA

USA . 296 parts In-Stock

1+ parts

$10.892

100+ parts

-

1k+ parts

-

10k+ parts

-

296

$10.892

-

-

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$12.441

100+ parts

$11.321

1k+ parts

$10.202

10k+ parts

-

70

$12.441

$11.321

$10.202

-

AZTECH Wire

Italy . 772 parts In-Stock

1+ parts

$12.830

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$12.830

-

-

-

MKK Technologies

India . 349 parts In-Stock

1+ parts

$16.004

100+ parts

-

1k+ parts

-

10k+ parts

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349

$16.004

-

-

-

DigiPath Technology Company

USA . 349 parts In-Stock

1+ parts

$16.004

100+ parts

-

1k+ parts

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10k+ parts

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349

$16.004

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-

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Parana Technologies

USA . 1,520 parts In-Stock

1+ parts

-

100+ parts

$10.176

1k+ parts

-

10k+ parts

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1,520

-

$10.176

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-

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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900

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Perfect Parts

USA . 808 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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808

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Corphita

USA . 420 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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420

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Overview

Unlock the potential of your designs with the VND5004BSP30TR-E from STMicroelectronics, a leader in innovative solutions. This robust peripheral driver promises unparalleled quality and reliability, making it perfect for various applications in automotive, industrial, and consumer electronics. With its compact, efficient design and impressive output capabilities, you’ll experience enhanced performance, reduced energy consumption, and seamless integration—delivering exceptional value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures a robust construction, providing reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for efficient PCB space utilization and facilitates automated assembly, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and is conducive to organized layouts, improving overall performance.

Power Supplies (V): 8/24

Support for a wide voltage range from 8 to 24V enhances versatility, allowing the product to fit various applications.

No. of Terminals: 30

With 30 terminals, this product offers extensive connectivity options, making it suitable for complex designs and applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for compact designs without compromising performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and resistance to oxidation, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting and layout options, facilitating easier integration into various PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for compatibility with standard surface mount soldering processes, ensuring reliable connections.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C ensures that the product can withstand high-temperature soldering processes without damage.

Maximum Output Current: 15 A

A maximum output current of 15A allows the driver to handle substantial loads, making it ideal for high-performance applications.

Terminal Form: GULL WING

Gull wing terminals are designed for easy handling and improved solder joint reliability, contributing to assembly efficiency.

Terminal Pitch: 1 mm

A terminal pitch of 1mm allows for a high density of connections in limited space, catering to compact electronic designs.

Driver No. of Bits: 2

With a 2-bit driver configuration, this product offers sufficient control for many peripheral applications, ensuring flexibility in design.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate moisture sensitivity, suitable for standard handling and soldering techniques in production.

Nominal Output Peak Current Limit: 100 A

The nominal output peak current limit of 100A allows for temporarily handling high current surges, increasing system reliability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter type interface makes it versatile for various applications, providing stability and enhancing signal integrity.

Output Current Flow Direction: SINK

The sink output current flow direction is advantageous in driving loads efficiently while minimizing signal integrity issues.

Technical Specifications

Peripheral Drivers VND5004BSP30TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

30

Output Current Flow Direction:

SINK

Maximum Output Current:

15 A

Nominal Output Peak Current Limit:

100 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.75,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND5004BSP30TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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