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VNB35N07

STMicroelectronics

VNB35N07 by STMicroelectronics

VNB35N07 by STMicroelectronics is an N-channel Power FET with 60V DS breakdown voltage, 0.035 ohm RDS(on), and 125W power dissipation. Ideal for enhancement mode operation in applications requiring high efficiency and fast switching such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 9,030 parts In-Stock

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Anansix

USA . 1,644 parts In-Stock

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Digiode

USA . 1,071 parts In-Stock

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1,071

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Vyrian

USA . 281 parts In-Stock

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281

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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Pegasus Components GmbH

Germany . 26 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 467 parts In-Stock

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$0.549

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-

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$0.494

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467

$0.549

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$0.494

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.881

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$0.802

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$0.722

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350

$0.881

$0.802

$0.722

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MKK Technologies

India . 62 parts In-Stock

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$1.033

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$1.033

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DigiPath Technology Company

USA . 62 parts In-Stock

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$1.033

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62

$1.033

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Microchip USA

USA . 356 parts In-Stock

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$7.677

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356

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AZTECH Wire

Italy . 446 parts In-Stock

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$13.301

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Ampacity Inc.

Singapore . 1,598 parts In-Stock

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$55.050

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RC Electronics

USA . 20,000 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Lixinc

USA . 8,764 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 917 parts In-Stock

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$0.657

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Corphita

USA . 447 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 92 parts In-Stock

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Overview

Unlock the power of innovation with the VNB35N07 by STMicroelectronics. Designed with precision and reliability in mind, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance for a variety of applications. Whether you're looking to enhance your electronic devices or optimize power management systems, this complex configuration transistor delivers maximum power dissipation of 125 W in a compact small outline package. Trust STMicroelectronics to provide cutting-edge technology and superior quality that exceeds expectations. Elevate your projects with the VNB35N07 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current in one direction, making it suitable for various applications.

Configuration: COMPLEX

Enables the FET to handle more complex circuit designs and functions, offering versatility in usage.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 60 V

Provides a high level of protection against voltage spikes and surges, enhancing the reliability of the FET.

Package Shape: RECTANGULAR

Offers a compact and standardized form factor, making it compatible with various electronic devices and applications.

Terminal Form: GULL WING

Facilitates easy soldering and mounting on PCBs, ensuring secure connections and reliability in operation.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the FET's conductivity, enhancing efficiency and performance in circuit operation.

No. of Terminals: 2

Simplifies circuit connections and reduces complexity in design, making it easier to integrate the FET into existing systems.

Maximum Power Dissipation (Abs): 125 W

Handles high power levels effectively, making it suitable for demanding applications that require efficient power management.

Package Style (Meter): SMALL OUTLINE

Occupies minimal space on PCBs, allowing for more compact and streamlined device designs without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and efficiency, making it a reliable choice for various industrial and consumer electronics applications.

Transistor Element Material: SILICON

Provides high conductivity and thermal stability, ensuring consistent performance and longevity of the FET.

Maximum Turn On Time (ton): 800 ns

Enables fast switching speeds, reducing latency and improving overall responsiveness in circuit operations.

Maximum Turn Off Time (toff): 1350 ns

Ensures rapid turn-off capability, minimizing power losses and enhancing efficiency in dynamic circuit functions.

Terminal Finish: MATTE TIN

Provides corrosion resistance and reliable electrical connections, enhancing the overall durability and performance of the FET.

Maximum Drain-Source On Resistance: 0.035 ohm

Offers low resistance for efficient power flow, reducing heat dissipation and improving overall energy efficiency.

Terminal Position: SINGLE

Simplifies circuit layout and connections, ensuring ease of integration and compatibility with various electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) VNB35N07 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

1350 ns

Maximum Turn On Time (ton):

800 ns

Trade Compliance

VNB35N07 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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