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VN772K-E

STMicroelectronics

VN772K-E by STMicroelectronics

VN772K-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 4 functions. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,184 parts In-Stock

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3,184

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Digiode

USA . 2,283 parts In-Stock

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2,283

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Anansix

USA . 1,484 parts In-Stock

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1,484

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ACDS - Activité Composants Distribution Service

France . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 607 parts In-Stock

1+ parts

$4.070

100+ parts

-

1k+ parts

$3.663

10k+ parts

-

607

$4.070

-

$3.663

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Microchip USA

USA . 495 parts In-Stock

1+ parts

$7.184

100+ parts

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495

$7.184

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MKK Technologies

India . 1,606 parts In-Stock

1+ parts

$7.654

100+ parts

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1,606

$7.654

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DigiPath Technology Company

USA . 1,606 parts In-Stock

1+ parts

$7.654

100+ parts

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1,606

$7.654

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Corphita

USA . 2,649 parts In-Stock

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2,649

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Parana Technologies

USA . 1,338 parts In-Stock

1+ parts

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100+ parts

$4.866

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1,338

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$4.866

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iodParts Technologies Inc.

India . 307 parts In-Stock

1+ parts

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307

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Overview

Elevate your designs with the VN772K-E from STMicroelectronics, a trusted leader in innovation and quality. This advanced peripheral driver guarantees reliable performance with built-in protections against transients and overcurrents, ensuring your applications run smoothly and safely. Ideal for automotive and industrial uses, it combines robust functionality with a compact design, delivering exceptional value that enhances efficiency and peace of mind for engineers everywhere.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures excellent protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on PCBs and facilitates automated manufacturing processes.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can be suitable for a wide range of applications, including industrial and automotive electronics.

No. of Functions: 4

Offering four functions in one package enhances design flexibility and reduces component count, saving both space and cost.

Package Shape: RECTANGULAR

The rectangular shape provides an efficient layout for PCB design and can fit into compact spaces without compromising performance.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

These comprehensive built-in protections ensure reliability and safety of the device, safeguarding it against common issues that may arise in operation.

No. of Terminals: 28

With 28 terminals, this product can handle complex interfacing and connectivity requirements, making it suitable for various applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables high-density placement and easier integration into compact electronic designs.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with a wide variety of power sources, enhancing its application versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish improves solderability and provides excellent electrical connection reliability over time.

Terminal Position: DUAL

The dual terminal position simplifies PCB layout and can improve routing options, accommodating various mechanical designs.

Maximum Seated Height: 2.65 mm

The low profile is ideal for applications where space is at a premium and can contribute to overall system compactness.

Width: 7.5 mm

A moderate width facilitates integration into narrow spaces while maintaining signal integrity and ease of soldering.

Length: 17.9 mm

The length provides a good balance for various applications, making it suitable for both high-speed and low-power designs.

Terminal Form: GULL WING

Gull wing terminals support easy soldering and provide strong mechanical stability for reliable connections.

Nominal Supply Voltage: 13 V

Optimal performance at a nominal supply voltage of 13 V allows for efficient operation within its rated parameters.

Turn-on Time: 2.3 us

Quick turn-on time enhances responsiveness, making this product ideal for time-sensitive applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports fine-pitch PCB designs, allowing for compact assemblies without sacrificing performance.

Nominal Output Peak Current Limit: 9 A

With a high current limit, this driver can handle demanding loads, making it suitable for powerful peripheral devices.

Turn-off Time: 16 us

A reasonable turn-off time contributes to effective control of peripheral devices, ensuring consistent performance in various conditions.

Technical Specifications

Peripheral Drivers VN772K-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

4

No. of Terminals:

28

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

16 us

Turn-on Time:

2.3 us

Width:

7.5 mm

Trade Compliance

VN772K-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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