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VN771K-E

STMicroelectronics

VN771K-E by STMicroelectronics

VN771K-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 4 functions. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in compact designs.

Median Price

$4.524

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 355 parts In-Stock

1+ parts

$4.524

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$4.524

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-

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Vyrian

USA . 8,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

8,317

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-

-

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Digiode

USA . 2,640 parts In-Stock

1+ parts

-

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1k+ parts

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2,640

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-

-

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Anansix

USA . 2,190 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,190

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,243 parts In-Stock

1+ parts

$12.561

100+ parts

-

1k+ parts

$11.305

10k+ parts

-

2,243

$12.561

-

$11.305

-

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$20.870

100+ parts

-

1k+ parts

-

10k+ parts

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852

$20.870

-

-

-

MKK Technologies

India . 556 parts In-Stock

1+ parts

$23.620

100+ parts

-

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556

$23.620

-

-

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DigiPath Technology Company

USA . 556 parts In-Stock

1+ parts

$23.620

100+ parts

-

1k+ parts

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10k+ parts

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556

$23.620

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 17,015 parts In-Stock

1+ parts

-

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17,015

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Microchip USA

USA . 5,110 parts In-Stock

1+ parts

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5,110

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Corphita

USA . 1,681 parts In-Stock

1+ parts

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1,681

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Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

-

100+ parts

$15.018

1k+ parts

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1,498

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$15.018

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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100+ parts

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350

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Overview

Unlock unparalleled performance with the VN771K-E from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile peripheral driver excels across diverse applications, ensuring robust protection against transient, overcurrent, and thermal challenges. Experience seamless integration in your designs, backed by STMicroelectronics’ commitment to quality and reliability. Elevate your projects with a solution that combines efficiency, safety, and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental conditions, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 36 V

A high maximum supply voltage ensures compatibility with a wider range of power supply systems, suitable for demanding applications.

No. of Functions: 4

Offering multiple functions in a single package reduces the number of components needed, simplifying circuit design and reducing board space.

Package Shape: RECTANGULAR

The rectangular shape is standard for many PCB layouts, ensuring compatibility with various designs and simplifying integration.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protection features enhance device reliability and longevity by preventing damage from electrical anomalies.

No. of Terminals: 28

The availability of 28 terminals ensures versatility for a variety of connections, enabling complexity in design without sacrificing performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for more compact designs.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows for energy-efficient operation, making it suitable for battery-powered applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel-palladium-gold finish ensures excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positioning provides flexible layout options for circuit design, facilitating easier routing of signals on the PCB.

Maximum Seated Height: 2.65 mm

A low seated height enables the design of slimmer devices while ensuring compatibility with standard PCB thicknesses.

Width: 7.5 mm

A compact width of 7.5 mm is advantageous for high-density circuit designs, making the product suitable for modern electronics.

Length: 17.9 mm

A balanced length aids in optimizing the layout on a PCB while maintaining efficient thermal and electrical performance.

Terminal Form: GULL WING

Gull wing terminals facilitate a strong mechanical connection and ease of soldering, improving assembly reliability.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V provides a stable operating point, ensuring predictable performance across a variety of applications.

Turn-on Time: 4.5 us

A fast turn-on time of 4.5 microseconds enhances responsiveness, making it suitable for high-speed applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a good balance between compact design and ease of soldering, suitable for high-density applications.

Nominal Output Peak Current Limit: 9 A

The capability to handle a peak current limit of 9 A makes this driver ideal for powering demanding loads without compromising performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter-based peripheral driver expands its versatility for various control applications.

Turn-off Time: 25 us

The 25 microsecond turn-off time allows for efficient switching, contributing to lower power consumption in dynamic applications.

Technical Specifications

Peripheral Drivers VN771K-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

4

No. of Terminals:

28

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

25 us

Turn-on Time:

4.5 us

Width:

7.5 mm

Trade Compliance

VN771K-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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