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VN750STR-E

STMicroelectronics

VN750STR-E by STMicroelectronics

VN750STR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features an output current limit of 9A, ideal for automotive applications. Its compact design (4.9mm x 3.9mm) ensures efficient space utilization in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 3,387 parts In-Stock

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3,387

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Anansix

USA . 2,722 parts In-Stock

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2,722

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Vyrian

USA . 2,014 parts In-Stock

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2,014

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Digiode

USA . 859 parts In-Stock

1+ parts

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859

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SIE Connect GmbH - GreenChips

Germany . 500 parts In-Stock

1+ parts

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500

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Greenchips

USA . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 162 parts In-Stock

1+ parts

$4.690

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162

$4.690

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IDEA Electronic Components Group

UK . 546 parts In-Stock

1+ parts

$9.783

100+ parts

-

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$8.805

10k+ parts

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546

$9.783

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$8.805

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MKK Technologies

India . 1,797 parts In-Stock

1+ parts

$18.397

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1,797

$18.397

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DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$18.397

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1,797

$18.397

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AZTECH Wire

Italy . 1,148 parts In-Stock

1+ parts

$21.970

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1,148

$21.970

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Lixinc

USA . 10,205 parts In-Stock

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10,205

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 1,686 parts In-Stock

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1,686

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Parana Technologies

USA . 853 parts In-Stock

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$11.697

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$11.697

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Corphita

USA . 59 parts In-Stock

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59

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Overview

Elevate your designs with the VN750STR-E from STMicroelectronics, a leading name in innovation. This robust peripheral driver combines reliability and superior performance, featuring built-in protections for transient, over-current, and thermal challenges. Ideal for automotive and industrial applications, it ensures seamless operation while maximizing efficiency. Trust in ST’s commitment to quality, and experience enhanced durability and peace of mind in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures a lightweight, cost-effective solution while providing adequate protection for internal components.

Surface Mount: YES

Surface mount technology allows for compact design and high-density packing on PCBs, maximizing space efficiency in applications.

Maximum Supply Voltage: 36 V

A high maximum supply voltage makes this peripheral driver suitable for a wide range of applications, allowing flexibility in system design.

Package Shape: RECTANGULAR

The rectangular shape is optimal for PCB layouts, enabling efficient use of space and alignment with standard footprints.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance reliability and longevity of the device, making it safer in demanding environments.

Power Supplies (V): 8/36

Compatibility with a broad voltage range (8V to 36V) allows versatility across different applications and power supply types.

No. of Terminals: 8

Having 8 terminals allows for a variety of connection options, facilitating integration with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline provides a compact footprint that is ideal for space-constrained applications while maintaining performance.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows for operation in battery-powered or low-voltage systems, improving versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal position facilitates easier design choices and flexibility in PCB layouts, aiding in routing and connections.

Maximum Seated Height: 1.75 mm

Low seated height supports compact PCB designs and minimizes profile, which is crucial for sleek electronic device designs.

Width: 3.9 mm

A narrow width contributes to space-saving designs and allows for densely packed boards without sacrificing performance.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures compatibility with standard assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature capability of 260 °C ensures this product can endure the rigors of modern soldering processes.

Length: 4.9 mm

Compact length supports integration into smaller electronic designs and is suitable for various applications that require compact components.

Maximum Output Current: 2 A

A maximum output current capability of 2 A is sufficient for many peripheral applications, providing robust performance.

Terminal Form: GULL WING

Gull wing terminals provide a reliable mechanical connection and support etch patterns on PCBs, making assembly easier.

Nominal Supply Voltage: 13 V

Operating at a nominal supply voltage of 13V is ideal for many applications, providing a sweet spot for performance and efficiency.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch offers compatibility with a variety of standard footprints, enhancing versatility in design.

Nominal Output Peak Current Limit: 9 A

High output peak current limit of 9 A accommodates demanding peripheral loads, ensuring reliable operation under peak conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based peripheral driver, this product offers essential functionality for signal management in various applications.

Output Current Flow Direction: SINK

The sink output current flow direction is suitable for various applications, enabling control of inductive loads and reducing design complexity.

Technical Specifications

Peripheral Drivers VN750STR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

VN750STR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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