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VN610SP-E

STMicroelectronics

VN610SP-E by STMicroelectronics

VN610SP-E by STMicroelectronics is a peripheral driver with a max output current of 45A. It has built-in protections for transient, over current, over voltage, thermal, and under voltage conditions. This driver is commonly used in applications requiring buffer or inverter based interface ICs.

Median Price

$2.450

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.450

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750

$2.450

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Chip Stock

USA . 3,400 parts In-Stock

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3,400

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Vyrian

USA . 2,560 parts In-Stock

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2,560

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Anansix

USA . 1,953 parts In-Stock

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1,953

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Digiode

USA . 1,837 parts In-Stock

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1,837

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Semi Source

USA . 45 parts In-Stock

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45

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NexGen Digital

USA . 10 parts In-Stock

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10

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LittleDiode

UK . 3 parts In-Stock

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3

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GES GmbH

Germany . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,198 parts In-Stock

1+ parts

$2.450

100+ parts

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3,198

$2.450

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Continental Prestige Electronics

USA . 1,603 parts In-Stock

1+ parts

$2.450

100+ parts

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1k+ parts

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$2.401

1,603

$2.450

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$2.401

AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$6.301

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355

$6.301

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Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$7.462

100+ parts

$6.790

1k+ parts

$6.119

10k+ parts

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95

$7.462

$6.790

$6.119

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Semicontronic

India . 961 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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961

$7.500

$7.312

$7.275

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Aztec Data Supply Inc.

USA . 4,780 parts In-Stock

1+ parts

$7.790

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4,780

$7.790

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Corohmni

South Africa . 544 parts In-Stock

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$11.371

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544

$11.371

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IDEA Electronic Components Group

UK . 1,441 parts In-Stock

1+ parts

$13.564

100+ parts

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$12.207

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1,441

$13.564

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$12.207

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Ampacity Inc.

Singapore . 827 parts In-Stock

1+ parts

$17.500

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827

$17.500

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MKK Technologies

India . 1,729 parts In-Stock

1+ parts

$25.505

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1,729

$25.505

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DigiPath Technology Company

USA . 1,729 parts In-Stock

1+ parts

$25.505

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1,729

$25.505

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Perfect Parts

USA . 8,509 parts In-Stock

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8,509

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Microchip USA

USA . 7,448 parts In-Stock

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Corphita

USA . 3,576 parts In-Stock

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3,576

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Parana Technologies

USA . 1,144 parts In-Stock

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$16.217

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1,144

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$16.217

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Kepictronics

USA . 50 parts In-Stock

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50

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Assy Fe

Spain . 6 parts In-Stock

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6

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Overview

Discover the VN610SP-E by STMicroelectronics, a high-quality peripheral driver that offers exceptional value and benefits to customers. With its built-in protections against transient, over current, over voltage, thermal, and under voltage situations, this product ensures reliable and safe operation in various applications. Manufactured by STMicroelectronics, a renowned leader in the industry, you can trust in the superior quality and performance of the VN610SP-E. Whether you need buffer or inverter based peripheral drivers, this versatile product is sure to meet your needs. Experience the advantages of the VN610SP-E and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to external factors, making this peripheral driver suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, making it convenient and efficient for integration in various electronic devices.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage of 36V, this peripheral driver can handle demanding electrical systems and provide reliable performance even under high voltage conditions.

No. of Functions: 1

This peripheral driver is designed to perform a single function efficiently, ensuring simplicity and ease of use in applications that require specific driver tasks.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standardized designs and simplifies the integration process, making it a versatile choice for different electronic systems.

Built-in Protections: TRANSIENT, OVER CURRENT, OVER VOLTAGE, THERMAL, UNDER VOLTAGE

The inclusion of multiple built-in protections ensures the safety and reliability of the connected peripherals by guarding against various potential risks, making this driver a secure choice for critical applications.

Power Supplies (V): 8/36

Supporting power supplies from 8V to 36V, this peripheral driver offers flexibility and compatibility with a wide range of voltage inputs, making it suitable for diverse electronic systems.

No. of Terminals: 10

With 10 terminals, this peripheral driver enables easy connectivity and integration into complex wiring systems, providing versatility and adaptability to different device configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style, combined with a heat sink/slug design, enhances thermal dissipation and allows for efficient heat management, ensuring optimal performance and longevity of the driver.

Minimum Supply Voltage: 5.5 V

With a low minimum supply voltage of 5.5V, this peripheral driver remains operational even under low voltage conditions, making it suitable for battery-powered applications or devices with varying power levels.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and promoting long-term stability in various environments.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient wiring options, accommodating different circuit arrangements and simplifying the installation process.

Maximum Seated Height: 3.75 mm

The low maximum seated height of 3.75mm contributes to compact and space-efficient designs, making this peripheral driver ideal for applications where size is a constraint.

Width: 7.5 mm

With a narrow width of 7.5mm, this peripheral driver offers a compact footprint, enabling it to be utilized in space-limited electronic systems or densely populated circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable solder connections during the manufacturing process, enhancing the overall quality and durability of the product.

Peak Reflow Temperature °C: 250

Capable of withstanding peak reflow temperatures up to 250°C, this peripheral driver is well-suited for lead-free soldering processes, providing compatibility with modern assembly techniques.

Length: 9.4 mm

With a length of 9.4mm, this peripheral driver maintains a compact form factor, facilitating its integration into space-constrained electronic designs without compromising functionality.

Maximum Output Current: 45 A

With a high maximum output current of 45A, this peripheral driver can efficiently drive power-hungry peripherals, ensuring proper functionality in demanding applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and promotes reliable connections, making it suitable for high-volume manufacturing and assembly processes.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V indicates the designated voltage for optimal operation, ensuring compatibility with a range of electronic systems that utilize this voltage level.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides compatibility with standard PCB layouts and enables easy integration into existing designs or breadboarding, streamlining the development process.

Driver No. of Bits: 1

With a single driver bit, this peripheral driver simplifies circuit design and reduces complexity, offering a straightforward solution for applications that require a single bit of driver control.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to humidity during storage and handling, ensuring proper precautions are taken to maintain the product's integrity.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver incorporates buffer or inverter-based interface IC technology, enabling seamless communication and control between the driver and the connected peripherals.

Output Current Flow Direction: SINK

The output current flow direction of "sink" indicates that the peripheral driver can effectively sink current from the connected peripherals, offering reliable control and management of electrical loads.

Technical Specifications

Peripheral Drivers VN610SP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Maximum Output Current:

45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VN610SP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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