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VN5E025AJ-E

STMicroelectronics

VN5E025AJ-E by STMicroelectronics

VN5E025AJ-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 28V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact 12-terminal design for efficient surface mounting. Ideal for applications requiring reliable power management in low-profile setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,445 parts In-Stock

1+ parts

-

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1k+ parts

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5,445

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Anansix

USA . 2,604 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,604

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-

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Digiode

USA . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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263

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LWI Electronics Inc

India . 16 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$4.027

100+ parts

-

1k+ parts

$3.624

10k+ parts

-

960

$4.027

-

$3.624

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Microchip USA

USA . 179 parts In-Stock

1+ parts

$6.599

100+ parts

-

1k+ parts

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10k+ parts

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179

$6.599

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-

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MKK Technologies

India . 411 parts In-Stock

1+ parts

$7.572

100+ parts

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411

$7.572

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-

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DigiPath Technology Company

USA . 411 parts In-Stock

1+ parts

$7.572

100+ parts

-

1k+ parts

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10k+ parts

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411

$7.572

-

-

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AZTECH Wire

Italy . 953 parts In-Stock

1+ parts

$9.700

100+ parts

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10k+ parts

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953

$9.700

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 4,938 parts In-Stock

1+ parts

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4,938

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Parana Technologies

USA . 362 parts In-Stock

1+ parts

-

100+ parts

$4.815

1k+ parts

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10k+ parts

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362

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$4.815

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Overview

Elevate your design with the VN5E025AJ-E from STMicroelectronics, a leading name in high-quality semiconductor solutions. This versatile peripheral driver combines advanced built-in protections for maximum reliability and performance across diverse applications, from automotive to industrial control systems. With its compact footprint and robust voltage capabilities, it ensures seamless integration while delivering exceptional efficiency and durability, making it a smart choice for engineers seeking value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures lightweight and durable packaging, enhancing reliability and thermal properties.

Surface Mount: YES

Surface mount technology provides ease of integration and saves space on the PCB, making it suitable for compact designs.

Maximum Supply Voltage: 28 V

A maximum supply voltage of 28 V allows for a wide range of applications without the risk of damage from overvoltages.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization and aligned mounting options for better PCB layout.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Built-in protections enhance the safety and reliability of the device, preventing damage from common electrical faults.

Power Supplies (V): 8/28

Support for a supply voltage range of 8 to 28 V makes it versatile for various applications requiring different voltage levels.

No. of Terminals: 12

Having 12 terminals allows for multiple connections, improving functionality and making it adaptable for complex systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The low profile and small outline design saves board space, while the heat sink feature enables efficient thermal management.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage of 4.5 V means the device can operate in low-power environments, enhancing energy efficiency.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options and simplified routing on the PCB.

Maximum Seated Height: 1.62 mm

The low seated height ensures the component fits well in compact spaces, perfect for modern electronics.

Width: 3.9 mm

A compact width makes it suitable for densely packed PCB designs while still maintaining performance.

Length: 4.9 mm

Short length contributes to a smaller footprint on the PCB, facilitating more design options for complex circuits.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connections and reliable soldering, ensuring structural integrity.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V optimizes performance while ensuring compatibility with standard voltage levels in many systems.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch strikes a balance between space-saving design and ease of handling, promoting efficient assembly.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being based on buffer or inverter technology makes the device versatile for various signal processing applications.

Output Current Flow Direction: SINK

Sink current capability allows it to be used effectively in applications where current needs to flow into the device, enhancing its utility.

Technical Specifications

Peripheral Drivers VN5E025AJ-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G12

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

VN5E025AJ-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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