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VIPER15LD

STMicroelectronics

VIPER15LD by STMicroelectronics

VIPER15LD by STMicroelectronics is a compact switching regulator with a max input voltage of 23.5V and operates at a frequency of 250kHz. It features a dual terminal design in a small outline package, ideal for space-constrained applications. This current-mode controller excels in efficient power management for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,315 parts In-Stock

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6,315

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Digiode

USA . 2,684 parts In-Stock

1+ parts

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2,684

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R&J Components

USA . 1,000 parts In-Stock

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1,000

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Anansix

USA . 987 parts In-Stock

1+ parts

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987

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ACDS - Activité Composants Distribution Service

France . 950 parts In-Stock

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950

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Bristol Electronics

USA . 950 parts In-Stock

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950

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Dan-Mar Components

USA . 950 parts In-Stock

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950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 545 parts In-Stock

1+ parts

$5.500

100+ parts

-

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545

$5.500

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Microchip USA

USA . 108 parts In-Stock

1+ parts

$8.511

100+ parts

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108

$8.511

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AZTECH Wire

Italy . 538 parts In-Stock

1+ parts

$13.480

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538

$13.480

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

1+ parts

$17.727

100+ parts

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$15.955

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1,138

$17.727

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$15.955

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MKK Technologies

India . 1,413 parts In-Stock

1+ parts

$33.335

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1,413

$33.335

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DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$33.335

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1,413

$33.335

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Corphita

USA . 2,268 parts In-Stock

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2,268

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 872 parts In-Stock

1+ parts

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$21.196

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872

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$21.196

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Overview

Unlock superior performance and reliability with the VIPER15LD from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact switching regulator offers exceptional efficiency and stability for your applications, from consumer electronics to industrial systems. With its robust design and advanced current-mode control, experience unmatched value that enhances your projects while simplifying integration. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCB layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for better layout and routing flexibility.

Number of Terminals: 16

With 16 terminals, this product offers multiple connections for enhanced functionality and versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes footprint, making it ideal for space-constrained applications.

Control Mode: CURRENT-MODE

Current-mode control provides improved transient response and stability, ensuring consistent performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes enhance reliability and provide excellent conductivity, ensuring better electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatility in circuit design, accommodating various layout configurations.

Maximum Seated Height: 1.75 mm

The low seated height helps to maintain a compact profile, critical for portable or dense electronic devices.

Width: 3.9 mm

A narrow width aids in fitting the device into tight spaces, making it suitable for compact applications.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it efficiently regulates voltage, resulting in less heat generation and improved performance.

Nominal Input Voltage: 14 V

With a nominal input voltage of 14 V, it suits a wide range of applications, particularly in power management.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard soldering processes, contributing to ease of manufacture.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature tolerance allows the device to withstand the soldering process without damage.

Length: 9.9 mm

A compact length facilitates easy placement on PCBs, essential for modern electronics with tight form factors.

Maximum Switching Frequency: 250 kHz

A high switching frequency contributes to efficient power conversion, allowing for better performance in compact designs.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection during assembly and are commonly used in surface-mounted devices.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation enhances the efficiency and performance of the regulator, enabling better load handling.

Switcher Config: SINGLE

A single switcher configuration simplifies design and reduces component count, making it cost-effective.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with a wide range of PCBs and layouts, facilitating easier integration.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding proper storage and handling procedures for enhanced reliability.

Minimum Input Voltage: 8.5 V

The ability to operate at a minimum input voltage of 8.5 V expands applicability to various power supply designs.

Maximum Input Voltage: 23.5 V

With a maximum input voltage of 23.5 V, it offers flexibility and can handle a wide range of input sources.

Technical Specifications

Switching Regulators & Controllers VIPER15LD attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

23.5 V

Minimum Input Voltage:

8.5 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

250 kHz

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

VIPER15LD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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