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TSX3704IDT

STMicroelectronics

TSX3704IDT by STMicroelectronics

TSX3704IDT from STMicroelectronics is a CMOS comparator featuring a max input offset voltage of 6mV, an average bias current of just 1.2nA, and operates within -40 °C to 125 °C. Ideal for automotive applications, it offers four functions in a compact SO package.

Median Price

$1.955

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,374 parts In-Stock

1+ parts

$2.640

100+ parts

$1.550

1k+ parts

$1.190

10k+ parts

$1.100

4,374

$2.640

$1.550

$1.190

$1.100

Rochester

USA . 820 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

820

-

$1.270

$1.140

$1.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 566 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

-

10k+ parts

-

566

$0.730

-

-

-

Vyrian

USA . 4,285 parts In-Stock

1+ parts

$0.768

100+ parts

-

1k+ parts

-

10k+ parts

-

4,285

$0.768

-

-

-

TME

Poland . 199 parts In-Stock

1+ parts

$1.130

100+ parts

$0.810

1k+ parts

-

10k+ parts

-

199

$1.130

$0.810

-

-

Anansix

USA . 1,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,199 parts In-Stock

1+ parts

$0.691

100+ parts

-

1k+ parts

-

10k+ parts

-

1,199

$0.691

-

-

-

Continental Prestige Electronics

USA . 100 parts In-Stock

1+ parts

$0.800

100+ parts

$0.537

1k+ parts

$0.374

10k+ parts

-

100

$0.800

$0.537

$0.374

-

Vigor

Singapore . 1,361 parts In-Stock

1+ parts

$1.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

$1.180

-

-

-

IDEA Electronic Components Group

UK . 696 parts In-Stock

1+ parts

$1.515

100+ parts

-

1k+ parts

$1.364

10k+ parts

-

696

$1.515

-

$1.364

-

MKK Technologies

India . 697 parts In-Stock

1+ parts

$2.849

100+ parts

-

1k+ parts

-

10k+ parts

-

697

$2.849

-

-

-

DigiPath Technology Company

USA . 697 parts In-Stock

1+ parts

$2.849

100+ parts

-

1k+ parts

-

10k+ parts

-

697

$2.849

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$5.827

100+ parts

$5.303

1k+ parts

$4.778

10k+ parts

-

350

$5.827

$5.303

$4.778

-

Microchip USA

USA . 4,691 parts In-Stock

1+ parts

$6.143

100+ parts

-

1k+ parts

-

10k+ parts

-

4,691

$6.143

-

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RC Electronics

USA . 27,000 parts In-Stock

1+ parts

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27,000

-

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iodParts Technologies Inc.

India . 5,040 parts In-Stock

1+ parts

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5,040

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-

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Kepictronics

USA . 4,870 parts In-Stock

1+ parts

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4,870

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

-

-

-

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Parana Technologies

USA . 151 parts In-Stock

1+ parts

-

100+ parts

$1.812

1k+ parts

-

10k+ parts

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151

-

$1.812

-

-

Overview

Elevate your designs with the TSX3704IDT from STMicroelectronics, a leading innovator in semiconductor solutions. This compact CMOS comparator excels in automotive applications, offering unmatched precision and reliability under extreme conditions. With its low power consumption and rapid response time, you can trust this component to enhance performance while saving energy. Experience superior quality and innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and reliability in various applications.

Maximum Input Offset Voltage: 6000 uV

A low maximum input offset voltage enhances precision and accuracy in signal processing, making it ideal for sensitive applications.

Maximum Average Bias Current (IIB): 0.0012 uA

This very low bias current results in energy-efficient operation, perfect for battery-powered devices.

Surface Mount: YES

Surface mount functionality allows for compact designs and easier integration into modern electronic circuits.

No. of Functions: 4

With four functions available, this comparator can perform multiple tasks, adding versatility to its use.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout, optimizing space utilization in circuit designs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes it suitable for low-voltage applications and devices.

No. of Terminals: 14

Having 14 terminals allows for greater connectivity options and flexibility in circuit integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, supporting compact design requirements.

Maximum Supply Voltage Limit: 18 V

The ability to handle up to 18V enables this comparator to be used in a wide range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for high-temperature environments, including automotive applications.

Output Type: PUSH-PULL

The push-pull output type allows for efficient signal driving, improving the performance of connected devices.

Nominal Response Time: 2400 ns

A nominal response time of 2400 ns enables fast signal processing, ideal for high-speed applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures (-40 °C) makes it suitable for harsh environments and automotive applications.

Terminal Position: DUAL

Dual terminal position facilitates easier handling and integration into existing circuit layouts.

Maximum Seated Height: 1.75 mm

A low seated height profile supports compact designs and is beneficial for low-profile PCB assemblies.

Width: 3.9 mm

A narrow width allows this component to fit into tight spaces, optimizing layout efficiency on PCs.

Length: 8.65 mm

An optimal length enhances board layout flexibility, catering to various design needs.

Temperature Grade: AUTOMOTIVE

This temperature grade ensures reliability and performance in automotive applications, where conditions can be extreme.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it suitable for battery-powered and portable devices.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and provides mechanical stability in mounting.

Amplifier Type: COMPARATOR

As a comparator, this product is designed for precise level detection, making it perfect for precision applications.

Packing Method: TR

Tray packaging (TR) allows for organized and efficient handling during assembly and manufacturing processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of soldering for assembly.

Technical Specifications

Comparators TSX3704IDT attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6 mV

Peak Bias Current:

1.2 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

2.4 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Trade Compliance

TSX3704IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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